Flexible Circuit Board Seed Layer Electroplating
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Solution Overview
Problem
Conventional flexible circuit board manufacturing methods fail to meet the demands for miniaturization and thickness reduction, limiting their application in modern electronic devices.
Innovation Solution
The method involves a flexible circuit board structure comprising a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer, manufactured using processes such as photolithography and electroplating, which allows for the formation of patterned conductive layers and seed layers, enabling circuit miniaturization and thickness reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding method with mechanical drilling or laser drilling is used, then manufacturing process is mature and easy to implement, but circuit miniaturization and thickness reduction cannot be achieved
Solution Approach 1:
The patent replaces mechanical drilling and bonding processes with electroplating technology. Instead of using mechanical drills or lasers to create through-holes and bond layers, the invention uses electroplating to directly form conductive pathways and seed layers on the flexible substrate, eliminating the need for mechanical intervention and enabling finer feature sizes
Solution Approach 2:
The patent changes the manufacturing parameters by using electroplating current density, plating time, and solution composition to control the thickness and distribution of conductive layers. This allows precise control over layer thickness and circuit geometry, enabling miniaturization that cannot be achieved with conventional mechanical methods
2Manufacturing precision
If photolithography and electroplating processes are used, then circuit miniaturization and thickness reduction are achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple functions into the electroplating process. The same electroplating step that forms the conductive layer also creates the seed layer for subsequent plating operations, and the photolithography pattern defines both the circuit geometry and the plating mask, reducing the need for separate processing steps
Solution Approach 2:
The patent performs preliminary actions by first forming the seed layer through electroplating before creating the final conductive patterns. The photolithography step is performed in advance to create the pattern mask that will guide the subsequent electroplating process, ensuring precise pattern transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of flexible circuit boards with reduced thickness and increased miniaturization, enhancing their suitability for various electronic devices by improving adhesion and reliability through precise control of layer thickness and design.
Implementation Method 1
The first seed layer is disposed on the first flexible substrate
Implementation Method 2
manufactured using processes such as photolithography and electroplating
Implementation Method 3
A second seed layer is disposed on the first conductive layer
Data Source
AI summary
An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.