Electronic Module With Inductor-Wrapping Circuit Board
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Solution Overview
Problem
The challenge is to reduce the size and thickness of electronic modules as they accommodate an increasing number of electronic devices while maintaining functionality.
Innovation Solution
The solution involves an electronic module design that incorporates a circuit board with both rigid and flexible substrates, which wraps around the body of an inductor, allowing electronic devices to be placed on the lateral surfaces of the inductor, thereby reducing the module's thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic devices are increased in number within the module, then functionality is improved, but the module size and thickness increase
Solution Approach 1:
The patent transitions from a conventional planar PCB layout to a three-dimensional structure where the circuit board wraps around the inductor body. This dimensional change allows electronic devices to be mounted on the lateral surfaces of the inductor, effectively utilizing vertical space and reducing the overall module thickness while accommodating more components.
Solution Approach 2:
The circuit board is designed to wrap around and nest along the lateral surface of the inductor body. This nesting arrangement allows the circuit board to conform to the inductor's geometry, maximizing space utilization and enabling higher component density without increasing module thickness.
2Length of stationary object
If circuit board wraps around inductor body, then module thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs a flexible substrate for the circuit board that can be formed into a wraparound configuration. This flexible film approach simplifies the manufacturing process compared to rigid structured solutions, as the flexible substrate can be molded or bent into the required shape around the inductor body using conventional fabrication techniques.
3Volume of moving object
If electronic devices are placed on lateral surfaces of inductor, then space utilization is improved, but assembly difficulty increases
Solution Approach 1:
The patent integrates the inductor body and circuit board into a unified assembly where the circuit board wraps around the inductor. This merging of components creates a compact integrated structure that maximizes space utilization while simplifying assembly, as the wrapped configuration is formed during manufacturing rather than requiring separate assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the thickness of the electronic module to less than 3 mm, enhances design flexibility by using electrodes on the bottom surface for connection, and supports various IC forms without being limited to embedded ICs.
Implementation Method 1
The first circuit board is attached to the first lateral surface via an adhesive layer disposed over the first lateral surface.
Data Source
AI summary
An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.