Thermally Conductive Structure for Circuit Board Heat Dissipation
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Solution Overview
Problem
Multilayer circuit boards experience significant heating issues due to application processors with multiple functions and high performance, leading to potential overheating and reliability problems.
Innovation Solution
Incorporation of a thermally conductive structure with high thermal conductivity materials like copper, graphite, or graphene, strategically positioned within the circuit board to absorb and dissipate heat, along with an adhesion improving primer layer to enhance thermal management and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If application processors with multiple functions and high performance are mounted on multilayer boards, then device capabilities and performance are improved, but heating of circuits increases significantly
Solution Approach 1:
A thermally conductive structure is introduced as an intermediary between the application processor and the circuit board. This structure includes a thermally conductive layer positioned between the processor and the board, along with thermally conductive vias that extend through the board to dissipate heat. The intermediary structure enables high-performance processing while managing the thermal effects through dedicated heat dissipation pathways.
2Temperature
If thermally conductive structures are inserted into insulating parts, then heat dissipation is improved, but adhesion between structures may be insufficient
Solution Approach 1:
The thermally conductive structure employs composite material construction, combining thermally conductive materials with adhesion-promoting features. The structure includes an adhesion improving part with a primer layer that enhances bonding between the thermally conductive structure and the insulating part. This composite approach maintains both thermal conductivity and strong adhesion, preventing delamination while effectively dissipating heat.
3Adaptability or versatility
If electronic components are mounted on multilayer boards, then device functionality is improved, but temperature deviations and warpage increase
Solution Approach 1:
The circuit board design implements local quality variations through strategically positioned thermally conductive structures. These structures are placed in specific regions where heat generation occurs, creating localized heat dissipation zones. The board also incorporates regions with different thermal conductivities to manage heat flow patterns, thereby reducing temperature deviations and preventing warpage while maintaining device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces heat transfer time and temperature deviations across the circuit board, improving reliability and performance by efficiently distributing heat away from hotspots, thus alleviating overheating issues.
Implementation Method 1
a first thermally conductive structure including a thermally conductive material, at least a part of the first thermally conductive structure being inserted into the insulating part
Implementation Method 2
an adhesion improving part disposed on a surface of the first thermally conductive structure to increase adhesion between the first thermally conductive structure and the insulating part
Data Source
AI summary
A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.