High-Current Connector Alignment Soldering Leg
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Solution Overview
Problem
Existing high-current connectors face alignment issues with circuit boards due to potential deviations during assembly, making it difficult to align contact pins with soldering holes, and lack sufficient shunt paths for multiple-path current distribution.
Innovation Solution
A high-current connector design featuring a conductive mating member with an alignment soldering leg and a conductive combined shunt, where the alignment soldering leg facilitates easy alignment with the circuit board, and additional shunt pins and second conductive holes enhance current distribution paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the contact socket is assembled with the base block using interference-fit, then the connection strength is improved, but the alignment precision between contact pins and soldering holes deteriorates
Solution Approach 1:
The base block is divided into an upper block and a lower block that are separately assembled to the contact socket. This segmentation allows the contact socket to be first precisely aligned with the upper block, and then the lower block is added to provide interference-fit fixation, thereby separating the alignment function from the fixation function and resolving the contradiction between connection strength and alignment precision.
2Device complexity
If the contact socket is assembled with the base block in a single piece, then the device complexity is reduced, but the ease of assembly deteriorates
Solution Approach 1:
The base block is segmented into upper and lower blocks that can be assembled separately to the contact socket. This allows the contact socket to be first positioned and aligned, then fixed with the upper block, and finally secured with the lower block. The segmented design simplifies the assembly process by enabling step-by-step assembly rather than requiring complex one-step assembly of a monolithic base block.
3Device complexity
If traditional single-path current distribution is used, then the device complexity is reduced, but the current distribution efficiency deteriorates
Solution Approach 1:
The current distribution is segmented into multiple parallel paths: a first current path through the first contact pin and first soldering hole, and a second current path through the second contact pin and second soldering hole. This multi-path current distribution segments the current flow to improve distribution efficiency and reduce current concentration, while the overall connector structure remains relatively simple.
Solution Approach 2:
The patent introduces a vertical dimension to current distribution by utilizing the height of the contact socket and base block structure. Multiple contact pins are arranged at different vertical positions and horizontal locations, creating three-dimensional current paths that increase current distribution capacity without significantly increasing planar footprint or device complexity.
Data Source
AI summary
A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.