Integrated Carrier Plate and Conductor Structure for Motor Vehicle Door Locks
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Solution Overview
Problem
The separate production of carrier plates and conductor structures for motor vehicle door lock component carriers incurs increased costs and is error-prone due to separate transportation and electrical contacting processes.
Innovation Solution
A combined plastic injection and metal casting process is used to produce the component carrier, integrating the conductor structure and carrier plate in a single injection-molding tool, followed by sealing with a potting compound for protection and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate production of carrier plate and conductor structure is used, then manufacturing flexibility is maintained, but production costs increase and manufacturing complexity increases
Solution Approach 1:
The patent combines the production of the carrier plate and conductor structure into a single integrated injection molding process. The mold includes both a cavity for the carrier plate and a separate injection unit for the conductor structure, allowing both components to be manufactured simultaneously as one piece, thereby reducing production costs and eliminating separate assembly steps.
Solution Approach 2:
The injection molding tool is designed with multi-functionality, serving both to produce the carrier plate and to form the conductor structure within the same tool. This universal tooling approach eliminates the need for separate production lines and reduces overall manufacturing complexity despite the integrated nature of the process.
2Productivity
If separate production and transportation of conductor structure and carrier plate is used, then production flexibility is maintained, but error-proneness increases and productivity decreases
Solution Approach 1:
By integrating the production of both components in one process, the patent eliminates the transportation and separate assembly steps that lead to errors. The conductor structure and carrier plate are formed together in the same mold, ensuring proper alignment and connection without manual intervention, thus improving both productivity and reliability.
Solution Approach 2:
The conductor structure is pre-formed within the mold cavity during the same injection process that creates the carrier plate. This preliminary formation ensures that the conductor structure is already in its final position and configuration before the carrier plate solidifies, preventing assembly errors and reducing rework.
3Ease of manufacture
If integrated production process is used, then production costs are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The integrated mold is segmented into distinct functional zones: a cavity for the carrier plate and a separate injection unit for the conductor structure. This segmentation allows each zone to be optimized independently for its specific requirements while maintaining overall integration, thereby managing precision requirements without sacrificing the cost benefits of integrated production.
Solution Approach 2:
The patent employs parameter changes in the injection molding process, such as controlling injection pressure, temperature, and timing, to ensure that both the carrier plate and conductor structure are formed with the required precision simultaneously. By adjusting these parameters, the process achieves high manufacturing precision while maintaining the cost advantages of integrated production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated process reduces production costs and manufacturing effort, providing a mechanically stable and durable component carrier that is protected from environmental influences, while eliminating the need for separate production and assembly steps.
Implementation Method 1
the conductor structure and the carrier plate are produced in a combined plastic injection and metal casting process
Implementation Method 2
the carrier plate is usually produced in a plastic injection mold
Implementation Method 3
the carrier plate including the conductor structure and with the electrical/electronic components mounted thereon are sealed by means of a potting compound
Data Source
AI summary
A component carrier for electrical/electronic parts for attachment in a motor-vehicle door lock. Said component carrier is equipped with at least one carrier plate of plastic and with a metal conducting-track structure for electrically contacting the parts. According to the invention, the conducting-track structure and the carrier plate are produced in a combined plastic injection-molding and metal casting method.


