High Voltage Tank Assembly PCB Insulation Design

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Solution Overview

Problem

Existing high voltage tank assemblies in radiation generators are bulky and inefficient, requiring numerous diodes and capacitors, which complicates packaging and leads to unequal voltage distribution during transient conditions, affecting the accuracy and compactness of the design.

Innovation Solution

A compact high voltage tank assembly design utilizing a printed circuit board with multiple slots and an insulating cover, where electrical components are mounted on both surfaces of the board, and a capacitive core element is used to provide insulation and regulate stray capacitance, allowing for high-density packing and uniform voltage distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple diodes with low PIV rating are connected in series to achieve high voltage, then the required PIV is met, but the number of components increases and packaging becomes difficult

Engineering Contradiction:
ImprovePIV ratingVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the PIV parameter of individual diodes by connecting them in series to achieve the required high PIV rating. Multiple diodes with lower individual PIV ratings are arranged in series to collectively withstand the high reverse voltage, thereby meeting the reliability requirement without requiring each individual diode to have an excessively high PIV rating.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The voltage multiplier assembly is segmented into multiple stages, with each stage containing series-connected diodes. This segmentation allows the high voltage requirement to be distributed across multiple components, making the overall system more manageable and enabling compact packaging through modular arrangement.

Inventive Principle:
Principle #1Segmentation

2Reliability

If diodes are connected in series to achieve high PIV, then the voltage rating is sufficient, but unequal voltage distribution occurs during transient conditions

Engineering Contradiction:
Improvevoltage ratingVSAvoidvoltage distribution uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent incorporates feedback mechanisms through the circuit configuration where voltage distribution across series-connected diodes is monitored and adjusted. The circuit design ensures that during transient conditions, the voltage across each diode self-regulates to maintain equal distribution, preventing any single diode from exceeding its PIV rating.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent achieves equipotentiality in terms of voltage distribution by designing the circuit such that all series-connected diodes operate at equal voltage potentials during normal and transient conditions. This is accomplished through symmetric circuit arrangement and careful selection of component values to ensure uniform voltage sharing.

Inventive Principle:
Principle #12Equipotentiality

3Reliability

If a long high voltage resistor divider is used to ensure sufficient insulation, then insulation is adequate, but the structure becomes bulky and voluminous

Engineering Contradiction:
ImproveinsulationVSAvoidresistor divider volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent applies nesting by placing the high voltage resistor divider inside the hollow cylindrical structure of the radiation source. The resistor divider is nested within the existing geometric framework of the radiation source, utilizing the internal space efficiently. This eliminates the need for external insulation structures and significantly reduces the overall volume of the high voltage tank assembly.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a more compact, efficient, and cost-effective high voltage tank assembly with improved voltage distribution and reduced component count, enhancing the accuracy and reliability of radiation generation while minimizing space and weight.

Implementation Method 1

an insulating cover configured to enclose the printed circuit board... the projections when fitted into the slots provide insulation barrier to the electrical components mounted on the printed circuit board

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a capacitive core element is used to provide insulation and regulate stray capacitance, allowing for high-density packing and uniform voltage distribution

Methodology Applied
Scientific EffectCapacitance regulation: Capacitance

Implementation Method 3

The voltage multiplier assembly generally comprises multiple multiplier stages configured to rectify and multiply the applied AC voltage depending on the number of the multiplier stages present

Methodology Applied
Scientific EffectVoltage multiplication:

Data Source

PatentUS7480364B2High voltage tank assembly for radiation generator
Publication Date: 2009.01.20 GE PRECISION HEALTHCARE LLC
  • US7480364B2 patent drawing
  • US7480364B2 patent drawing
  • US7480364B2 patent drawing

AI summary

A radiation generator comprising a radiation source, a high voltage tank assembly to energize the radiation source and a power circuit configured to supply alternating current (AC) power to the high voltage tank assembly is provided. The high voltage tank assembly comprises a voltage multiplier assembly configured to include a printed circuit board comprising multiple slots, plurality of electrical components configured to be mounted on the printed circuit board and at least one insulating cover with multiple projections configured to be placed on one of the first surface and the second surface of the printed circuit board. Further, the projections of the insulating cover are configured to fit into the slots of the printed circuit board. The projections when fitted into the slots provide insulation barrier to the electrical components mounted on the printed circuit board.