Embedded Electronic Module Design for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity of electronic devices requires more advanced power management systems, necessitating improved circuitry and additional components, which in turn increases the substrate area needed, posing a challenge in miniaturizing electronic modules like DC-DC converters and point of load (POL) converters while enhancing heat dissipation.
Innovation Solution
The electronic module design incorporates a substrate with embedded and surface-mounted electronic components, including discrete inductors with magnetic bodies, and a heat sink to increase heat dissipation, while a molding body protects the components and reduces the substrate area by optimizing component placement and land pattern on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more electronic components are added to improve power management system functionality, then the power management capability is improved, but the substrate area required increases
Solution Approach 1:
The patent transitions from traditional planar component layout to a three-dimensional stacked architecture where components are arranged vertically across multiple layers. Power management components are positioned on different substrates stacked together, enabling increased functionality without proportionally increasing the footprint area.
Solution Approach 2:
The patent implements nested packaging where smaller substrate modules containing power management components are integrated within a larger package structure. This allows multiple functional modules to be nested together, maximizing space utilization and reducing overall substrate area while maintaining comprehensive power management capabilities.
2Area of stationary object
If substrate area is reduced to miniaturize electronic modules, then the device portability is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes vertical stacking to create multiple heat dissipation pathways in the vertical dimension. Heat sinks and thermal management components are positioned on different layers, allowing heat to dissipate through multiple surfaces (top, bottom, and lateral surfaces of stacked modules) rather than relying solely on planar area.
Solution Approach 2:
The patent divides the power management system into multiple independent functional modules stacked together, each with its own heat dissipation path. This segmentation allows heat from different components to be managed separately through dedicated thermal vias, heat sinks, and cooling structures on each layer, preventing heat accumulation despite reduced overall size.
3Adaptability or versatility
If complex circuitry is added to handle increased features, then the electronic functionality is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent divides complex power management circuitry into multiple functional modules, each responsible for specific power conversion tasks. These modular units are stacked and interconnected through standardized interfaces, simplifying the design and manufacturing process compared to integrating all functions into a single complex circuit board.
Solution Approach 2:
The patent employs universal substrate designs and standardized interconnection schemes that can accommodate different power management configurations. The same basic substrate structure and component layout can be adapted for various power management requirements, reducing manufacturing complexity while maintaining functional versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the size of electronic modules and enhances heat dissipation capabilities, effectively addressing the space constraints and thermal management needs of complex electronic devices like smartphones and tablets.
Implementation Method 1
a heat sink disposed on at least one of the plurality of electronic components
Implementation Method 2
heat dissipation capabilities
Data Source
AI summary
An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding body disposed on the plurality of electronic components and, in further embodiments, the heat sink.