Resin-Based Conductive Adhesive Layer for Flexible Circuit Boards
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Solution Overview
Problem
Flexible circuit boards with copper or silver conductive layers face issues of thickness, flexibility, and signal transmission due to improper layout, leading to signal reflection, electromagnetic radiation, and distortion.
Innovation Solution
A flexible circuit board structure incorporating a conductive paste layer and a resin-based conductive adhesive layer with conductive particles, allowing for reduced thickness, enhanced flexibility, and directional conductivity, along with conductive vias for signal and grounding connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper or silver conductive layers are used in flexible circuit boards, then electrical conductivity is improved, but thickness increases and flexibility deteriorates
Solution Approach 1:
The patent uses a composite conductive paste layer combining silver particles, conductive resin, and adhesive materials. This composite structure achieves high electrical conductivity through the silver particle network while maintaining flexibility and reduced thickness through the resin matrix, resolving the contradiction between conductivity and thickness/flexibility
Solution Approach 2:
The patent changes the physical and chemical parameters of the conductive layer by using a paste formulation with specific particle sizes, resin types, and curing conditions. This allows optimization of both conductivity and mechanical properties (thickness and flexibility) simultaneously, rather than being constrained by solid metal foil limitations
2Reliability
If copper or silver conductive layers are used in flexible circuit boards, then electrical conductivity is improved, but flexibility deteriorates
Solution Approach 1:
The conductive paste layer combines rigid silver conductive particles with flexible resin and adhesive materials. The resin matrix provides flexibility and conformability while the silver particles form conductive pathways, achieving both high conductivity and excellent flexibility that solid metal foils cannot provide
Solution Approach 2:
By controlling the particle size distribution, resin composition, and curing parameters, the patent optimizes the balance between conductivity and flexibility. The paste can be formulated to maintain softness and flexibility while achieving required electrical performance, unlike rigid metal foils
3Productivity
If the number of signal transmission wiring lines is increased to handle more data, then data transmission capacity is improved, but signal reflection and electromagnetic radiation increase
Solution Approach 1:
The patent applies different paste formulations and particle distributions to different areas of the conductive layer. By optimizing the local composition and structure of the conductive paste, signal integrity is improved and electromagnetic interference is reduced in high-density wiring areas, allowing increased data transmission capacity without proportionally increasing harmful effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of conductive paste and resin-based adhesive layers provides improved flexibility and reduced thickness, enhancing signal transmission and reducing signal distortion and electromagnetic interference.
Implementation Method 1
The plurality of conductive particles establishes electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer
Implementation Method 2
the resin-based conductive adhesive layer comprises an anisotropic conductive film
Data Source
AI summary
A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.