Integrated Helical Inductor on Circuit Board Substrate
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Solution Overview
Problem
Conventional surface mount technology for inductive components in electronic products limits miniaturization and reliability due to soldering challenges, making it difficult to achieve compact and efficient packaging.
Innovation Solution
A circuit board structure and manufacturing method that integrates a magnetic structure and inductive coil with conductive pillars forming a helical structure, directly formed within the board to enhance inductive effects and reduce package size, using techniques like electroplating and dielectric layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface mount technology is used to assemble inductive components on the circuit board, then the inductive components can be integrated into the circuit board, but the package size cannot be sufficiently miniaturized and reliability is compromised due to soldering challenges
Solution Approach 1:
The patent merges the inductive component structure directly into the circuit board by forming conductive pillars that extend through the substrate and create integrated inductive coils, eliminating the need for separate surface-mounted inductive components. This integration achieves both miniaturization and improved reliability by removing soldering joints.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional integration by forming conductive pillars that extend vertically through the substrate and creating inductive coils that utilize the vertical dimension, thereby achieving compact packaging without compromising reliability.
2Volume of moving object
If surface mount technology is used to assemble inductive components on the circuit board, then the inductive components can be integrated into the circuit board, but miniaturization is limited due to additional component sizes
Solution Approach 1:
The patent combines multiple functions into a single integrated structure where the circuit board substrate, conductive pillars, and inductive coils form a unified component, eliminating the need for separate surface-mounted inductive components and achieving significant miniaturization.
Solution Approach 2:
The circuit board substrate serves multiple functions: it provides mechanical support, electrical connections through conductive pillars, and hosts the inductive coil structure, thereby reducing the overall component count and package size while maintaining functionality.
3Ease of manufacture
If conventional surface mount technology is used, then inductive components can be assembled on the circuit board, but manufacturing reliability is compromised due to soldering challenges
Solution Approach 1:
The patent integrates the inductive component manufacturing into the circuit board fabrication process itself, forming conductive pillars and coils through the same substrate processing steps, thereby eliminating separate soldering operations and improving manufacturing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact and reliable integration of inductive components, enhancing inductive effects while reducing package size, thereby addressing the limitations of conventional surface mount technology.
Implementation Method 1
The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure
Implementation Method 2
The magnetic material is iron, cobalt, nickel, rubidium, or an alloy thereof
Data Source
AI summary
A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.