Carrier Substrate With Embedded Heat Pipe for PCB Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional carrier substrates face challenges in heat dissipation, especially when components like power amplifiers or ICs are embedded, leading to overheating due to inadequate cooling, and integrated heat pipes often collapse under lamination pressure, reducing their efficiency.
Innovation Solution
A carrier substrate design featuring thermal vias connected to a heat pipe, where the heat pipe is embedded in a groove between two substrates adhered with an adhesive, protecting the heat pipe from pressure and ensuring efficient heat dissipation through thermal vias and a heat spreader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat pipe is integrated into the carrier substrate during lamination, then heat dissipation capability is improved, but the heat pipe collapses under lamination pressure
Solution Approach 1:
The heat pipe is pre-embedded in a groove within the carrier substrate before the lamination process. This preliminary positioning protects the heat pipe from direct exposure to lamination pressure, preventing collapse while maintaining thermal contact with the substrate
Solution Approach 2:
The groove acts as an intermediary structure that accommodates the heat pipe during lamination. By providing a protective cavity, the groove mediates between the heat pipe (which needs protection) and the lamination process (which applies pressure), allowing both to coexist without conflict
2Quantity of substance
If components are embedded in the PCB to increase integration density, then component density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The solution transitions from 2D surface mounting to 3D embedding, utilizing the vertical dimension within the PCB layers. Components are positioned within the substrate thickness, enabling higher integration density while the embedded heat pipe provides thermal management in the same three-dimensional space
3Temperature
If thermal vias are used to connect embedded components to cooling structures, then heat dissipation path is improved, but manufacturing complexity increases
Solution Approach 1:
The thermal vias are integrated into the existing PCB manufacturing process as part of the lamination sequence. The via formation, heat pipe embedding, and substrate lamination are combined into a single manufacturing flow, reducing the number of separate steps and tooling requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents heat pipe collapse and enhances heat dissipation, allowing for denser circuit integration without overheating, even when components are fully embedded, by using thermal vias and a heat spreader connected to a cooling device.
Implementation Method 1
thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe
Implementation Method 2
heat pipe
Data Source
AI summary
The present invention relates to a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises a first substrate with thermal vias configured to be connected to a first component; a second substrate comprising a groove with a heat pipe; and wherein the first substrate is adhered to the second substrate by an adhesive, such that the heat pipe is embedded in said groove between the first substrate and the second substrate. The present invention also relates to an electronic assembly comprising such a carrier substrate.