Insulating Substrate Metal Adhesion Improvement TRIZ Cases
- Adhesive-Free Copper Flexible Substrate for Fine Etching
Controlling copper roughness and grain size improves resist adhesion, etching quality, and defect reduction in adhesive-free flexible substrates.
- Copper-Ceramic Bonded Substrate Edge Composition for Thermal Cycling
Controlling Ag solid solution at copper edges suppresses hardening and peeling, improving ceramic bond reliability under thermal cycling.
- Silicon Nitride Bonded Substrate Structure for Stronger Copper Adhesion
Silver-containing penetrating regions in silicon nitride improve copper bonding strength, cold durability, and migration resistance.
- Wiring Board Via Structure With Local Anti-Rust Layer Removal
Selective laser removal of the anti-rust layer in via bottoms lowers contact resistance while preserving corrosion protection on the wiring board.