Circuit Board Via Structure for Gas-Release Adhesion Control
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Solution Overview
Problem
The increasing area of the electrode part in semiconductor packages leads to gas accumulation, causing swelling and peeling of the electrode from the insulating layer, and the provision of through holes for gas discharge compromises rigidity and electrical characteristics.
Innovation Solution
A circuit board structure with a second via electrode having a smaller vertical length and a sloped horizontal width, anchored to the insulating layer, improves adhesion and maintains rigidity without affecting electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the area of the electrode part is increased to accommodate more semiconductor devices, then the mounting area and interconnection capability are improved, but gas accumulation occurs causing swelling and peeling of the electrode from the insulating layer
Solution Approach 1:
The electrode part is divided into multiple segments separated by gaps, allowing gas to escape through these gaps during the curing process. This prevents gas accumulation and swelling while maintaining the overall large area needed for mounting multiple semiconductor devices, thus preventing peeling and maintaining adhesion reliability.
2Object-affected harmful factors
If through holes are provided in the electrode part for gas discharge, then gas accumulation and swelling are prevented, but the rigidity of the semiconductor package decreases
Solution Approach 1:
Instead of creating through holes that compromise structural integrity, the electrode part is segmented into multiple sections with gaps. These gaps serve as gas discharge pathways during curing without penetrating through the entire electrode structure, thereby maintaining rigidity while preventing gas accumulation and swelling.
3Object-affected harmful factors
If through holes are provided in the electrode part for gas discharge, then gas swelling is prevented, but the electrical characteristics such as impedance matching are deteriorated
Solution Approach 1:
The electrode is segmented into multiple sections separated by gaps, which allow gas to escape during curing without creating through holes. This segmentation prevents gas swelling while maintaining the continuity and integrity of the electrode structure for electrical signal transmission, thus preserving impedance matching and other electrical characteristics.
4Productivity
If the number of semiconductor devices is increased to improve integration, then the performance and functionality are enhanced, but the area of the circuit board and electrode part increases leading to gas discharge problems
Solution Approach 1:
The electrode part is segmented into multiple sections with gaps between them, enabling effective gas discharge during the curing process. This allows the circuit board area and electrode area to be increased to accommodate more semiconductor devices for higher integration, while the gaps prevent gas accumulation and swelling that would otherwise occur with larger areas.
Data Source
AI summary
A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.