Ceramic Circuit Board Bonding Layer With Oxygen-Stabilized TiN
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Solution Overview
Problem
Existing ceramic circuit boards face limitations in further improving thermal cycle test (TCT) characteristics due to non-uniform dispersion of Cu and/or Al in the titanium nitride layer, leading to partial fluctuation of properties and insufficient bonding strength.
Innovation Solution
Incorporating a prescribed amount of oxygen into the titanium nitride layer, formed by the reaction between titanium and nitrogen, to stabilize the layer and enhance bonding strength and TCT characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Cu and/or Al are included in the titanium nitride layer to increase hardness, then the TCT characteristics are improved, but the dispersion state inside the titanium nitride layer becomes non-uniform causing partial fluctuation of properties
Solution Approach 1:
The invention changes the chemical composition parameter of the titanium nitride layer by introducing oxygen at a controlled concentration (0.1-10 at%). This parameter change stabilizes the layer structure and prevents non-uniform dispersion of Cu and/or Al, thereby resolving the contradiction between improving TCT characteristics and maintaining compositional stability
Solution Approach 2:
The invention creates a composite structure within the titanium nitride layer by incorporating oxygen along with Cu and/or Al. This composite approach (TiN-O-Cu/Al system) enhances both the hardness and the uniformity of dispersion, simultaneously improving TCT characteristics while maintaining compositional stability
2Reliability
If the titanium nitride layer is made harder by including Cu and/or Al, then the TCT characteristics are improved, but the bonding strength becomes insufficient due to partial fluctuation of properties
Solution Approach 1:
By adjusting the oxygen concentration parameter to 0.1-10 at%, the invention optimizes the bonding strength of the titanium nitride layer. This parameter change ensures uniform distribution of hardening elements (Cu/Al) while maintaining strong bonding, thus improving both TCT characteristics and bonding strength simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The presence of oxygen in the titanium nitride layer stabilizes the bonding interface, improving thermal conductivity and mechanical strength, thereby enhancing the overall performance of the ceramic circuit board.
Implementation Method 1
A titanium nitride layer that includes titanium nitride as a major component is formed at a nitride ceramic member and the interface between the bonding layer
Implementation Method 2
Incorporating a prescribed amount of oxygen into the titanium nitride layer, formed by the reaction between titanium and nitrogen, to stabilize the layer and enhance bonding strength
Data Source
Figure 1~2
Figure 3~4
AI summary
Provided is a bonded body comprising a titanium nitride layer that contains a predetermined amount of oxygen. A bonded body according to an embodiment of the present invention comprises a nitride-based ceramic member and a metal member bonded to the nitride-based ceramic member via a bonding layer. A titanium nitride layer comprising titanium nitride as a main component is formed in the interface between the nitride-based ceramic member and the bonding layer. The titanium nitride layer comprises a part containing oxygen in an amount of 1 at % or more.