Circuit Board Electrode Structure for Gas Release and Adhesion
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Solution Overview
Problem
The increasing area of semiconductor packages due to the mounting of multiple semiconductor devices leads to issues with gas discharge from the insulating layer, causing electrode swelling and potential peeling off, while traditional through holes in the electrode part decrease its area and rigidity.
Innovation Solution
A circuit board design featuring an electrode part with a first and second via electrode, where the second via electrode is connected to the second electrode and has a length in the vertical direction that is smaller than the first via electrode, improving adhesion between the insulating layer and the electrode part without compromising electrical characteristics or rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the area of the electrode part is increased to accommodate more semiconductor devices, then the mounting capacity is improved, but gas generated from the insulating layer cannot be sufficiently discharged causing electrode swelling and peeling
Solution Approach 1:
The electrode part is divided into multiple segments (first electrode, second electrode, and intermediate electrode) with through holes strategically positioned between them. This segmentation allows gas to be discharged at multiple locations rather than requiring a single large opening, enabling the electrode area to be increased while maintaining adhesion reliability through distributed gas escape paths.
2Reliability
If a through hole is provided in the electrode part for gas discharge, then gas discharge is improved, but the area and rigidity of the electrode part decrease
Solution Approach 1:
Through holes are provided only in specific regions (first and second electrode parts) rather than uniformly across the entire electrode structure. The intermediate electrode region maintains full continuity without through holes, creating local variations in structure that allow gas discharge where needed while preserving rigidity in critical load-bearing areas.
Solution Approach 2:
The electrode structure employs asymmetric design where the first and second electrodes have through holes for gas discharge, but the intermediate electrode maintains full continuity. This asymmetric arrangement optimizes gas discharge pathways while distributing structural strength unevenly to maintain overall rigidity despite the presence of through holes.
3Adaptability or versatility
If the number of semiconductor devices is increased to improve integration, then the functional capability is improved, but the area of the circuit board and electrode part increases leading to adhesion problems
Solution Approach 1:
The electrode structure is segmented into multiple regions with strategically positioned through holes that allow gas to escape during the curing process of the insulating layer. This segmentation enables the overall electrode area to be expanded to accommodate more semiconductor devices while maintaining manufacturing precision and adhesion quality through distributed gas discharge pathways.
Data Source
Figure 1a
Figure 1b
Figure 1c~1d
AI summary
A circuit board according to an embodiment includes an insulating layer; and, an electrode part disposed in the insulating layer, wherein the electrode part includes: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first electrode and the second electrode, the first via electrode is connected to the first electrode and the second electrode, and a length of the second via electrode in a vertical direction is smaller than a length of the first via electrode in the vertical direction.