Ceramic Circuit Board Bonding With Oxygen-Stabilized Titanium Nitride
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Solution Overview
Problem
Ceramic circuit boards with nitride ceramic substrates face challenges in achieving high bonding strength and thermal cycle test (TCT) characteristics, particularly when thinning the substrate, due to insufficient titanium nitride layer formation and stability, which can lead to reduced durability and heat dissipation.
Innovation Solution
A bonded body is created with a nitride ceramic member and a metal member bonded via a titanium nitride layer, where the titanium nitride layer includes a specific composition and structure, including an oxygen content of at least 1 at%, formed through thermal bonding using an active metal brazing material, ensuring a stable and effective bonding interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the nitride ceramic substrate is thinned to improve heat dissipation, then heat dissipation capability is improved, but bonding strength and TCT characteristics deteriorate due to insufficient titanium nitride layer formation
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding layer by controlling the oxygen content to be 1-10 at%, which fundamentally alters the properties of the titanium nitride layer. This parameter change enables the formation of a stable bonding interface even on thinned substrates, resolving the contradiction between heat dissipation improvement and bonding strength maintenance
2Temperature
If the nitride ceramic substrate is thinned to improve heat dissipation, then heat dissipation capability is improved, but TCT characteristics deteriorate due to titanium nitride layer instability
Solution Approach 1:
By precisely controlling the oxygen content parameter in the bonding layer (1-10 at%), the patent stabilizes the titanium nitride layer formation process. This parameter control ensures reliable TCT characteristics even when the substrate is thinned for improved heat dissipation, resolving the contradiction between heat dissipation and thermal cycle test performance
3Strength
If oxygen content in the bonding layer is increased to stabilize the titanium nitride layer, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent establishes a specific oxygen content range (1-10 at%) that optimizes bonding strength while maintaining manufacturing feasibility. This parameter specification provides clear manufacturing guidelines, balancing the need for strong bonding with practical manufacturing considerations, thus resolving the contradiction between bonding strength improvement and manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the bonding strength and TCT characteristics, preventing degradation of the titanium nitride layer due to oxidation, thus improving the durability and heat dissipation capabilities of the ceramic circuit board, even in high-temperature and humid environments.
Implementation Method 1
The active metal brazing material that includes titanium reacts with the nitride ceramic substrate to form a titanium nitride layer
Implementation Method 2
a bonded body is obtained by thermal bonding. The thermal bonding causes the active metal brazing material layer to become the bonding layer
Data Source
AI summary
A bonded body according to an embodiment includes a nitride ceramic member, and a metal member bonded with the nitride ceramic member via a bonding layer. A titanium nitride layer that includes titanium nitride as a major component is formed at a nitride ceramic member and the interface between the bonding layer. The titanium nitride layer includes a location at which an oxygen amount is not less than 1 at %.