Conductive Inkjet Thin Wires With Controlled Wetting and Adhesion
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Solution Overview
Problem
Conventional methods for forming conductive thin wires on a base material using conductive ink face challenges in improving thin wire formability, conductivity, and transmittance.
Innovation Solution
A method involving a conductive ink with specific solvent properties and a base material with controlled surface energy and contact angles, combined with an undercoat layer, is used to form conductive thin wires, enhancing adhesion and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional conductive ink is used for inkjet printing, then the conductive thin wire can be formed, but the thin wire formability, conductivity, adhesion, and transmittance cannot be improved
Solution Approach 1:
The patent changes the physical and chemical parameters of the conductive ink by specifying a particular solvent composition (main solvent with boiling point ≤ water's boiling point, secondary solvent with higher boiling point and log P > 0.5) and base material surface energy (<40 mN/m). This parameter optimization enables the formation of ultra-fine wires with diameters of 10 μm or less while maintaining high conductivity and reliability
Solution Approach 2:
The patent applies preliminary action by preparing the base material surface in advance to achieve the required surface energy of less than 40 mN/m and controlling the contact angle conditions before inkjet printing. This preliminary surface preparation ensures that the conductive ink forms uniform ultra-fine wires with excellent adhesion and conductivity
2Length of moving object
If the conductive ink is applied to form thin wires, then the wire thickness can be reduced, but the adhesion and stability of the thin wire deteriorate
Solution Approach 1:
The patent optimizes the solvent composition parameters, specifically using a secondary solvent with log P > 0.5 and appropriate boiling point, which controls the drying process and solvent evaporation rate. This parameter control enables the formation of ultra-fine wires with thickness of 10 μm or less while maintaining strong adhesion to the base material
Solution Approach 2:
The patent uses the solvent system as an intermediary that mediates between the conductive material particles and the base material. The specific solvent composition facilitates uniform distribution and strong bonding of conductive particles, enabling thin wire formation with excellent adhesion
3Length of moving object
If the conductive ink spread is suppressed to form thin wires, then the wire thickness is reduced, but the ink stability and uniformity worsen
Solution Approach 1:
The patent changes the ink composition parameters by selecting a main solvent with boiling point ≤ 100°C and a secondary solvent with higher boiling point and log P > 0.5. This parameter combination suppresses ink spread during printing while maintaining ink stability and uniformity, enabling consistent formation of ultra-fine wires with thickness of 10 μm or less
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves thin wire formability, conductivity, and transmittance by suppressing ink spread and preventing bulge formation, ensuring stable adhesion of the conductive thin wire.
Implementation Method 1
a base material having a surface energy of less than 40 mN/m, and in which conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2≤θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2
Implementation Method 2
conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2≤θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2
Implementation Method 3
a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material
Data Source
AI summary
In a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, the base material has surface energy of less than 40 mN/m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2<θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2.