Castellated Panel-Molded Modules With Multi-Surface Contacts
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Solution Overview
Problem
Existing electronic power systems face challenges in achieving high power density, reducing mounting area on customer motherboards, and lowering costs while effectively forming edge connections and conductive features on encapsulated electronic assemblies, particularly in encapsulated power converters.
Innovation Solution
A method involving the assembly of an encapsulated panel with electronic components and conductive features, where holes are selectively formed along predetermined cut lines to expose conductive features, followed by the application of conductive metal layers and patterning to create electrical connections and thermal conduits, allowing for the singulation of electronic modules with castellated connections and integral heat-spreading EMI-shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If encapsulation is used to conduct heat out of components, then thermal management is improved, but manufacturing complexity increases due to the need for selective hole formation and conductive layer application
Solution Approach 1:
Conductive metal layers are deposited on the panel surfaces and within holes before the panel is cut into individual modules. This preliminary action ensures that thermal and electrical pathways are established in advance, simplifying the overall manufacturing process by combining multiple steps into a sequential workflow rather than requiring complex post-assembly operations.
Solution Approach 2:
The panel is divided into multiple individual modules through selective cutting along predetermined lines. This segmentation allows each module to be independently manufactured with standardized thermal management features, enabling scalable production while maintaining consistent heat conduction pathways across all modules.
2Power
If power density is increased, then system efficiency is improved, but mounting area on customer motherboard increases
Solution Approach 1:
The module utilizes three-dimensional encapsulation with conductive layers extending through the thickness of the panel, creating vertical thermal and electrical pathways. This dimensional approach allows higher power density to be achieved without proportionally increasing the horizontal mounting footprint, as heat dissipation and electrical connections are optimized through the depth of the package rather than just the surface area.
3Ease of manufacture
If cost is reduced, then manufacturing efficiency is improved, but manufacturing precision may deteriorate due to selective hole formation and conductive layer patterning
Solution Approach 1:
The conductive metal layers serve multiple functions simultaneously: they provide thermal conduction pathways, establish electrical connections, and act as EMI shields. This multi-functionality reduces the need for separate specialized features, simplifying the overall manufacturing process and reducing costs while maintaining the required precision for thermal and electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of leadless panel-molded power converter modules with increased power density, reduced size, and cost-effectiveness, while providing robust electrical connections and efficient heat management, suitable for surface mount soldering and stacking configurations.
Implementation Method 1
the panel including one or more electronic modules having boundaries defined by one or more predetermined cut lines, and the one or more conductive features having portions that are located along the cut lines
Implementation Method 2
selectively forming one or more conductive metal layers on selected surfaces of the panel including within the selected holes, each selected hole having a respective portion of the one or more conductive metal layers within the selected holes being in electrical contact with the respective portions of the one or more conductive features
Data Source
AI summary
Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.