Component Carrier Wiring Shape for Adhesion Without Signal Loss
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Solution Overview
Problem
Component carriers face challenges in maintaining mechanical robustness and electrical reliability, especially under harsh conditions, due to issues like delamination between layers and the need for effective heat dissipation. Additionally, the miniaturization of electronic components and the increasing number of contacts on component carriers complicate adhesion and signal propagation.
Innovation Solution
A component carrier with a base structure and an electrically conductive wiring structure featuring a nonrectangular cross-sectional shape is introduced. This design creates adhesion promoting constrictions that enhance mechanical interlocking between the wiring structure and the surrounding material, improving adhesion without the need for surface roughening, which can interfere with signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface roughening is applied to improve adhesion, then adhesion between layers is improved, but signal propagation quality deteriorates
Solution Approach 1:
The patent transitions from modifying the surface topology (2D roughening) to modifying the cross-sectional geometry (3D shape change). The wiring structure adopts a non-rectangular cross-section with constricted regions that protrude into surrounding material, achieving adhesion enhancement through volumetric geometry rather than surface roughness.
Solution Approach 2:
The patent employs curved side walls in the wiring structure's cross-section, replacing straight rectangular edges with rounded or concave profiles. This curvature creates the adhesion-promoting constriction features while maintaining smooth surfaces that do not interfere with signal propagation.
2Productivity
If miniaturization of electronic components is pursued, then product functionality increases, but adhesion between layers deteriorates
Solution Approach 1:
The patent applies local geometric modifications at specific regions of the wiring structure. The non-rectangular cross-section with constricted regions creates localized adhesion-promoting features at the wiring structure's boundaries, while the overall miniaturized dimensions are maintained. This local quality change enhances adhesion without requiring overall size increase.
Data Source
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AI summary
A component carrier (100) which comprises a base structure (102) and an electrically conductive wiring structure (106) on the base structure (102), wherein the wiring structure (106) has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction (108) is formed by at least one of the group consisting of the wiring structure (106) and a transition between the base structure (102) and the wiring structure (106).