Insulated Circuit Substrate Bonding With Guided Cushion Pressurization
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Solution Overview
Problem
In the manufacturing of insulated circuit substrates with thickened circuit layers, existing methods face challenges in ensuring uniform pressurization of the resin material and reliable bonding between the insulating resin layer and the metal piece, leading to potential voids and reduced insulating properties.
Innovation Solution
A manufacturing method that uses a pressurizing jig with a cushion material and a guide wall portion to suppress the deformation of the cushion material during pressurization, ensuring uniform pressurization and bonding of the resin material and metal piece in the laminating direction, even when the metal piece is disposed in a circuit pattern shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit layer is thickened to secure conductivity and thermal conductivity, then the conductivity and thermal conductivity are improved, but sagging is generated on the end surface and electric field is concentrated, reducing insulating properties
Solution Approach 1:
A resin composition layer is introduced as an intermediary between the metal substrate and the thickened metal piece circuit layer. This resin composition acts as a buffer that prevents direct contact between the metal substrate and the thick metal piece, thereby preventing sagging on the end surface and reducing electric field concentration, while still allowing the circuit layer to maintain its thickened structure for improved conductivity and thermal conductivity.
2Strength
If the metal piece is disposed on the resin composition before curing and pressurized and heated, then the insulating resin layer and metal piece are bonded, but in regions where the metal piece is not disposed, the pressurization is insufficient and voids are generated, reducing insulating properties
Solution Approach 1:
The resin composition layer is applied with varying thickness in different regions: a first thickness in regions where the metal piece is disposed (to ensure sufficient pressurization and bonding), and a second thickness greater than the first thickness in regions where the metal piece is not disposed (to compensate for lack of pressurization and prevent void formation). This local variation in resin thickness ensures uniform pressurization and bonding strength across the entire substrate while maintaining insulating properties.
3Strength
If a rubber-like elastic body is disposed on the metal piece to pressurize and heat the resin composition, then the resin composition is cured and bonding is achieved, but the peripheral portion of the rubber-like elastic body deforms and spreads outward, causing metal piece shifting or insufficient pressurization
Solution Approach 1:
A reinforcement piece is disposed on the rubber-like elastic body before pressurization to prevent the peripheral portion from deforming and spreading outward during the bonding process. This reinforcement piece acts as a constraint that counteracts the deformation tendency of the rubber-like elastic body, thereby preventing metal piece shifting and ensuring sufficient pressurization is applied to the resin composition for proper curing and bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of insulated circuit substrates with excellent insulating properties and reliable bonding between the resin and metal layers, preventing sagging and electric field concentration, and enhancing thermal conductivity.
Implementation Method 1
the resin composition is cured to constitute the insulating resin layer and the insulating resin layer and the metal piece are bonded to each other
Implementation Method 2
the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig
Implementation Method 3
a cushion material disposed on a side of the metal piece... the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization
Implementation Method 4
heat generated by the semiconductor element is transmitted to the heat sink side and is dissipated
Data Source
AI summary
An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.