Carrier Substrate Segmentation for Microelectronic Release
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Solution Overview
Problem
The existing methods for removing microelectronic assemblies from carrier substrates are slow and uneven due to the time required for solvents to dissolve the adhesive, which can damage the substrates and increase manufacturing costs.
Innovation Solution
A method involving a carrier substrate with depressions on its surface, reducing the contact area with the adhesive, and using solvent-soluble adhesives or thermally-degradable adhesives, allowing for faster and more even dissolution of the adhesive, facilitating quicker release of the microelectronic assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the adhesive is dissolved using solvents in a tub, then the microelectronic assembly can be released from the carrier substrate, but the process requires a considerable amount of time and the dissolution is uneven
Solution Approach 1:
The carrier substrate is segmented with through-holes that divide the adhesive layer into multiple sections, allowing solvents to access and dissolve the adhesive from multiple locations simultaneously, thereby reducing the overall dissolution time and improving release speed
Solution Approach 2:
The through-holes act as intermediaries that facilitate the transport of solvents through the carrier substrate, enabling uniform distribution of solvents across the adhesive layer and achieving even dissolution without requiring prolonged soaking time
2Ease of operation
If the adhesive is dissolved using solvents, then the microelectronic assembly can be released from the carrier substrate, but the substrates may be damaged
Solution Approach 1:
The through-holes serve as intermediary channels that enable controlled solvent flow, allowing the dissolution process to proceed uniformly and preventing localized solvent accumulation that could cause substrate damage while still achieving easy release
3Ease of operation
If the adhesive is dissolved using solvents, then the microelectronic assembly can be released from the carrier substrate, but manufacturing costs increase
Solution Approach 1:
The segmented carrier substrate with through-holes enables faster and more uniform adhesive dissolution, reducing the soaking time required and thereby lowering manufacturing costs while maintaining ease of release operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the time needed to dissolve the adhesive, minimizing damage to the substrates and lowering manufacturing costs by ensuring a faster and more controlled release of the microelectronic assemblies.
Implementation Method 1
The adhesive material is at least partially soluble in the solvent and the carrier substrate is submerged in the solvent such that the solvent contacts the adhesive material.
Data Source
AI summary
Methods for forming a microelectronic assembly (82) are provided. In one embodiment, the method includes providing a device substrate (50) having a plurality of electronic components (42) coupled thereto, and providing a carrier substrate (54) having first and second opposing surfaces (60, 62) and including a plurality of openings (58) extending between the first and second opposing surfaces (60, 62) and a plurality of depressions (64) formed on the first opposing surface (60). The method further includes attaching the device substrate (50) to the first opposing surface (60) of the carrier substrate (54) using an adhesive material (56) such that at least some of the adhesive material (56) is adjacent to at least some of the plurality of depressions (64), and removing the device substrate (50) from the carrier substrate (54).