Printed Circuit Assembling TRIZ Cases

An interconnect assembly with side walls and slots supports battery cell electrodes during ultrasonic welding, preventing bending and degradation.

An optical detection method replaces mechanical references to eliminate manufacturing tolerances and manual adjustments in headlamp assembly.

Segmented protective shells isolate electrolytic capacitors and pressure sensors from injection molding forces, enabling their use in robust circuit modules.

A stacked land grid array and redistribution card connects eight processor modules in a one-hop topology.

A thin power device substrate embeds a semiconductor chip in a central opening with vertical interconnecting structures for electrical contact.

A hollow conductive particle absorbs bonding pressure to protect display terminals from damage while maintaining electrical connectivity.

Asymmetric sub-substrates with chamfered corners resolve the contradiction between connection reliability and component density.

Apertures in interconnect components anchor conductive compounds to bonding pads, resolving the trade-off between fine pitch and mechanical strength.

Adding aluminum reduces undercooling and prevents Ag3Sn blade formation, maintaining joint strength during thermal aging.

Extending an alignment mark across both boards prevents misalignment defects caused by complex signal line routing in display devices.

A circuit board features a positioning slot and opening that secures a flexible flat cable main body through mechanical nesting.

Decouples lift tool from transport rails to isolate positioning precision from vibration, enabling repeatable substrate handling for fine pitch printing.

A switch module interrupts electrical connections between printed circuit board ground wirings using a bolt and insulating member.

Segmented BGA modules with specific grounding patterns optimize shielding performance while reducing verification effort for custom chip designs.

A circuit board manufacturing method bonds a first board with a convex post to a second board using heated adhesive.

Segmented printed circuit board with metal core layer reduces LED junction temperatures by providing dedicated thermal pathways through dielectric isolation.

A substrate board design uses variable thickness to create distinct rigid and flexible regions within a single material layer.

A multi-head mounting apparatus coordinates head movements to prevent physical collisions during high-speed component placement.

Segmented multi-layer interconnects with nonwettable barriers maintain fine pitch while reducing manufacturing costs and improving solder joint reliability.

A test element support uses an embedded thermal insulation element to separate active and non-active substrate areas.

Segmented joint material isolates vibrations in a laminated capacitor mounted structure, preventing acoustic noise variations caused by mechanical distortion.

A substrate bridge electrically connects memory modules to an electronic package on a printed circuit board.

A suction nozzle assembly adjusts its pickup position using a seam detection device to maintain accurate electronic component placement.

A solder ball module replaces press-fit pins with reflow soldering to secure electrical connections in high-speed connectors.

A resilient contact device connects electrically to a printed circuit board while mechanically securing the assembly.

Wetting vertical sidewalls on flip chip pads boosts density without sacrificing alignment reliability.

A fixture clamps a captive screw sleeve to expose the threaded shank for precise tool positioning and soldering.

A conductive ball uses a patterned nickel layer and tin-based solder to form a stable intermetallic compound.

Oversized conductive particles penetrate resin layers during thermocompression bonding to establish electrical connections, reducing manufacturing complexity.

A metal pillar between the pad and solder resist prevents horizontal solder extrusion, avoiding short circuits while maintaining high wiring density.

Additive printed insulator socket housing creates complex undercuts and hollows, reducing production costs while maintaining dimensional stability.

Optical recognition marks and cameras track substrate working table positions to prevent collisions caused by thermal expansion or assembly errors.

Immersion in a low-viscosity adhesive layer positions components accurately while extraction of the carrier foil resolves detachment difficulties.

Neutral coating prevents intermetallic formation, maintaining wettability and reducing cleaning frequency.

Positioning solder connections outside the chip component footprint extends crack propagation distance, delaying wire breakage in electronic control devices.

Testing unpopulated printed circuit boards at 150°C to 250°C simulates reflow soldering conditions to identify electrically unsafe connections early.

A light emitting device array substrate uses a segmented metal layer to absorb and dissipate heat from LED packages.

Segmented carrier substrate with depressions reduces adhesive contact area, enabling faster solvent dissolution and minimizing substrate damage during release.

A solder plating layer with homogeneous bismuth distribution ensures uniform melting during reflow processing of semiconductor bump electrodes.

Ultrasonic welding replaces soldering to extend operating temperature ranges beyond 125°C while maintaining manufacturing simplicity.

Merging the power distribution box and connector into one watertight assembly eliminates auxiliary boxes, enabling placement in harsh vehicle environments.

Printing flux on PCB pads via a custom flux head eliminates manual bump coating, reducing tact time and boosting productivity in flip chip packaging.

Reticulated surface pads with dielectric-filled gaps reduce capacitance, resolving impedance mismatch and noise coupling in high-frequency circuit boards.

Suspended flexible layered circuit structures with air gaps maintain LED junction temperatures without bulky heat sinks.

Segmented insulating carriers arranged side-by-side with metallic surface contacts resolve thermal fatigue and warping issues in high-power electronic circuits.

Segmented sensor layers nested within a multilayer circuit board enable secure component protection while allowing easier testing and recovery.

Tree-like conductive adhesive traces on flexible circuits dissipate static charge to prevent ESD damage during handling.

A cylindrical spacer uses a diameter-reduced portion to guide molten solder into a fillet via surface tension.

An integrated UV resin cover eliminates air gaps between the LED and light guide, reducing optical loss while enabling contoured vehicle mounting.

Mask aperture measuring units calculate mounting coordinates from screen mask pattern holes to ensure precise electronic component placement.