Electronic Component Mounting Position Correction via Seam Detection
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Solution Overview
Problem
In high-speed gantry-type electronic component mounting devices, the connection of storage tapes for continuous component supply leads to positional errors when component feeding units are dismounted and remounted, resulting in reduced pickup rates due to shifts in the suction nozzle's pickup position.
Innovation Solution
An electronic component mounting apparatus equipped with a seam detection device, a recognition camera, a recognition processing device, and a control device that adjusts the pickup position based on image recognition, ensuring accurate component placement and monitoring of remaining components to prevent errors and maintain efficient feeding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If storage tapes are connected to each other for continuous component supply, then component availability is improved, but positional accuracy deteriorates due to connection tape causing pickup position shifts
Solution Approach 1:
The seam detection device detects the connection tape between storage tapes in advance before the pickup position shift occurs. The control device uses this early detection to calculate and apply a position correction value, adjusting the pickup position proactively to compensate for the connection tape's presence and maintain accurate component pickup
Solution Approach 2:
The system implements a feedback mechanism where the seam detection device continuously monitors for connection tapes, and the control device adjusts the pickup position based on the detected seam location. This closed-loop control ensures that positional accuracy is maintained despite the presence of connection tapes linking multiple storage tapes
2Adaptability or versatility
If component feeding units are dismounted and remounted on the feeder base, then component supply flexibility is improved, but pickup accuracy deteriorates due to position shifts from dismount/mount operations
Solution Approach 1:
The recognition camera captures images of storage concave portions and the control device calculates position correction values before component pickup operations resume after dismount/mount. This preliminary position verification and correction ensures that even if the feeder base position shifts during dismount/mount operations, the pickup accuracy is restored and maintained
Solution Approach 2:
The system replaces mechanical position alignment methods with optical recognition and computational correction. Instead of relying on precise mechanical positioning during dismount/mount operations, the recognition camera captures images and the control device calculates correction values to compensate for positional shifts, substituting mechanical precision with optical-mechanical integration
3Device complexity
If suction nozzle pickup position is not adjusted for connection tape, then device complexity is reduced, but pickup rate deteriorates due to positioning errors
Solution Approach 1:
The control device performs multiple functions: it controls the seam detection device, calculates position correction values based on detected seams, and adjusts the pickup position. This multi-functional approach integrates detection and correction capabilities into the existing control system without adding significant device complexity, while maintaining high pickup rates through accurate position adjustment
Data Source
AI summary
A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.