Substrate Bridge for Compact Electronic Assembly Signal Integrity
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Solution Overview
Problem
Conventional electronic devices face challenges in reducing the size of printed circuit boards due to the need for multiple layers and large real estate to maintain signal integrity, which often compromises battery capacity.
Innovation Solution
The use of a substrate bridge to electrically connect a silicon-on-chip electronic package and a memory module, allowing for more compact design and reduced layer counts in printed circuit boards, thereby enabling smaller electronic devices with improved signal quality and potential for larger batteries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional printed circuit board routing is used to connect silicon-on-chip electronic package and memory module, then signal integrity specifications can be met, but the printed circuit board size becomes large which compromises battery capacity
Solution Approach 1:
A substrate bridge is introduced as an intermediary component between the silicon-on-chip electronic package and the memory module. This substrate bridge provides dedicated electrical connections that maintain signal integrity while reducing the routing burden on the printed circuit board, thereby allowing for a smaller overall board size without compromising signal quality.
Solution Approach 2:
The invention moves electrical connections from the two-dimensional plane of the printed circuit board to a three-dimensional arrangement by using the substrate bridge as a separate intermediate structure. This dimensional transition allows signals to be routed through a different spatial path, reducing the real estate required on the printed circuit board while maintaining signal integrity.
2Reliability
If multiple layers and large real estate are used on printed circuit board to maintain signal integrity, then signal quality is improved, but battery capacity is reduced
Solution Approach 1:
The substrate bridge acts as an intermediary that handles the complex multi-layer routing requirements, allowing the printed circuit board to be simplified to fewer layers. This redistribution of routing complexity enables both high signal quality and reduced board size, thereby accommodating larger battery capacity.
3Quantity of substance
If the printed circuit board size is reduced to accommodate larger battery, then battery capacity increases, but signal integrity specifications become difficult to meet
Solution Approach 1:
The substrate bridge serves as a mediator that assumes the signal routing function, allowing the printed circuit board to be minimized for battery accommodation while the substrate bridge maintains the necessary signal integrity through its dedicated connection paths.
Data Source
AI summary
The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.