Resilient Contact Device for PCB Shielding
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Solution Overview
Problem
Existing methods for securing printed circuit boards in electrically shielded housings often result in high surface pressures that lead to plastic deformation and increased contact resistance over time, causing signal interference and potential damage to the board.
Innovation Solution
A contact device with high permissible surface pressure and low creep tendency is used, which is electrically and mechanically connected to the printed circuit board, allowing high contact forces to be maintained without stressing the board material, and can be detached for reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional screws and holding sections are used to secure the printed circuit board, then mechanical anchoring is achieved, but high surface pressures cause plastic deformation and increased contact resistance
Solution Approach 1:
The patent introduces a resilient contact element as an intermediary between the screw/holding section and the printed circuit board. This contact element has a higher permissible surface pressure than the board material, allowing it to absorb the clamping forces without transmitting excessive pressure to the board, thereby preventing plastic deformation while maintaining reliable electrical contact
Solution Approach 2:
The patent changes the material parameters of the contact element to have significantly higher permissible surface pressure and elastic modulus compared to the printed circuit board material. This parameter change allows the contact element to withstand high clamping forces elastically while the board remains within its safe stress limits, resolving the contradiction between anchoring strength and contact stability
2Reliability
If high contact forces are applied to ensure good electrical contact, then contact resistance is reduced, but the printed circuit board material deforms plastically over time
Solution Approach 1:
The resilient contact element serves as a mediator that decouples the relationship between applied contact force and board stress. It allows high contact forces to be applied to the contact element itself (ensuring low contact resistance) while the element's elastic properties prevent these forces from causing plastic deformation in the board material
Solution Approach 2:
The patent employs composite material selection where the contact element is made from materials with superior mechanical properties (higher elastic modulus and permissible surface pressure) compared to the board material. This material differentiation allows the system to achieve both high contact force and board protection simultaneously
3Reliability
If the contact element is made resilient with high permissible surface pressure, then the board is protected from deformation, but the manufacturing complexity increases
Solution Approach 1:
The patent extracts the function of force distribution from the screw/holding section and assigns it to a dedicated resilient contact element. This separation allows the contact element to be optimized specifically for resilient contact with high permissible surface pressure, while the fastening mechanism remains simple. The contact element can be manufactured as a separate component and integrated into the assembly
Solution Approach 2:
By changing the material parameters of the contact element (higher elastic modulus, higher permissible surface pressure), the patent enables the use of simpler geometries and manufacturing processes. The contact element can be made from standard resilient materials (springs, elastomers, resilient plastics) that are well-established in manufacturing, balancing performance requirements with manufacturing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures constant contact resistance and prevents signal interference, maintaining mechanical and electrical integrity over the service life of the connection while allowing for effective heat dissipation.
Implementation Method 1
The contact element (19) is pressed into a recess (17) in the printed circuit board (1)... ensures that pressing forces act on the contact element (19), and not on material of the printed circuit board (1)... contact element with high permissible surface pressure
Implementation Method 2
corresponding contact element (19') made of resilient material... ensures constant contact resistance... maintaining mechanical and electrical integrity over the service life
Implementation Method 3
The recess (17) is through-contacted in order to implement the electrically conductive connection between the contact device (19) and the printed circuit board (1)
Implementation Method 4
allowing for effective heat dissipation... maintaining mechanical and electrical integrity over the service life
Data Source
Figure 1
Figure 1a
Figure 2
AI summary
The device has an electrically conductive disk-shaped contact device (19) electrically connected with an electrically conductive contact section (7) on a printed circuit board (1) directly or by a through-connection (17') provided in a recess (17) in the board. The contact device is mechanically and firmly connected with the board. A retaining section (5) is provided with an electrically conductive bearing surface (11). The contact device is galvanically, electrically connected on an upper- or lower side or on an inner-lying electrically conducting layer of the board with a layer structure.