Circuit Module Partial Encapsulation for Sensitive Components
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Solution Overview
Problem
Existing circuit modules cannot accommodate components like electrolytic capacitors and pressure sensors due to mechanical and operational constraints during encapsulation or injection molding, as these components cannot withstand the pressure and dimensional changes during the process.
Innovation Solution
A protective shell is used to partially surround sensitive electrical/electronic components, allowing them to be protected from the encapsulation or injection molding process while enabling their functionality, with the shell being partially embedded in a protective mass that completely surrounds the circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are completely encapsulated in protective mass through injection molding, then the circuit module achieves robust mechanical protection and corrosion resistance, but components like electrolytic capacitors and pressure sensors cannot be used because they cannot withstand the encapsulation pressure and require operational freedom
Solution Approach 1:
The protective enclosure is segmented into two distinct parts: a protective mass that encapsulates the circuit carrier and most components, and a protective shell that specifically houses sensitive components like electrolytic capacitors and pressure sensors. This segmentation allows different protection strategies for different component types, enabling both robust protection and component versatility.
Solution Approach 2:
The protective shell acts as an intermediary between the sensitive components and the protective mass. It mediates the interaction by providing a barrier that prevents the protective mass from directly contacting and damaging components like electrolytic capacitors, while still allowing the components to function properly with access to ambient pressure.
2Reliability
If pressure sensors are completely encapsulated in protective mass, then mechanical protection is achieved, but the sensors cannot record ambient air pressure
Solution Approach 1:
The protective enclosure is segmented to place pressure sensors within the protective shell rather than completely encapsulating them in protective mass. This allows the sensors to remain mechanically protected while maintaining direct exposure to ambient air pressure for accurate measurement.
Solution Approach 2:
The protective shell creates a local zone where pressure sensors can access ambient pressure while the rest of the circuit module enjoys the robust protection of complete encapsulation. This local quality differentiation enables both protection and measurement functionality.
3Adaptability or versatility
If a protective shell is used to protect sensitive components, then component compatibility and functionality are improved, but the device complexity increases
Solution Approach 1:
The protective shell serves multiple functions simultaneously: it protects sensitive components from encapsulation pressure, allows breathing components to expand and contract, provides mounting surfaces for components, and enables pressure sensors to access ambient pressure. This multi-functionality reduces the need for additional specialized structures.
Solution Approach 2:
The protective shell is designed as a thin-walled, relatively flexible structure compared to the rigid protective mass. This flexibility allows the shell to accommodate component breathing while maintaining structural integrity, and the thin-walled design minimizes material usage and complexity while providing sufficient protection.
Data Source
AI summary
The invention relates to a circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), encapsulated by a protective material (16), and at least one electrical/electronic component (18) encapsulated by a protective coating (20), protecting the at least one electrical/electronic component (18) from the protective material (16), and to a method for producing the circuit module (10). According to the invention, the protective coating (20) protecting the at least one electrical/electronic component (18) is only partially encapsulated by the protective material (16).