Solder Ball Module for High-Speed Connector Signal Integrity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional communication systems face signal integrity issues at high data rates due to impedance mismatching at the interface between electrical connectors and host circuit boards, primarily caused by geometrical changes and the length of press-fit connections.

Innovation Solution

A contact assembly with a solder ball module that includes a gathering housing with contact channels and solder balls, which are reflow soldered to the host circuit board, providing a reliable electrical connection by bypassing the need for press-fit connections and allowing for impedance control through the arrangement of contact channels and impedance control cavities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If press-fit compliant pins are used to connect the electrical connector to the host circuit board, then mechanical connection is achieved, but signal integrity deteriorates due to impedance mismatching

Engineering Contradiction:

Improvemechanical connection reliabilityVSAvoidsignal integrity

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the press-fit mechanical connection system with a solder ball attachment system. The contact assembly uses solder balls to create both mechanical and electrical connection to the host circuit board, eliminating the impedance mismatching problem associated with press-fit pins while maintaining reliable connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the connection parameter from press-fit mechanical insertion to reflow soldering process. This parameter change allows for precise control of the electrical connection characteristics and eliminates the geometric discontinuities that cause impedance mismatching in press-fit connections.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If press-fit connections are used, then assembly is simplified, but electrical performance deteriorates due to geometry changes at the interface

Engineering Contradiction:

Improveassembly simplicityVSAvoidelectrical connection precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the press-fit mechanical system with a solder ball attachment system that provides both mechanical support and electrical connection. This substitution eliminates the geometric discontinuities at the interface that cause impedance mismatching, while the solder ball array maintains assembly simplicity through a single attachment operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If conventional electrical connector interface is used, then compatibility is maintained, but high data rate transmission performance deteriorates

Engineering Contradiction:

Improveconnector compatibilityVSAvoiddata transmission rate

Core Design Contradiction:

Adaptability or versatilityVSSpeed

Solution Approach 1:

The patent changes the electrical connection parameter from press-fit to solder ball attachment, which eliminates the impedance mismatching that limits high-frequency performance. This parameter change enables high data rate transmission while maintaining physical compatibility with standard connector form factors through the gathering housing design.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances signal integrity and reliability by ensuring a consistent electrical connection, improving performance at high data rates by eliminating the limitations of conventional press-fit connections.

Implementation Method 1

The solder balls are electrically connected to the tips of the contact tails of corresponding contacts and being configured to be reflow soldered to circuits of the host circuit board

Methodology Applied

Scientific EffectReflow soldering: Soldering

Data Source

PatentUS10470313B1Solder ball module for contact assembly of an electrical connector

Publication Date: 2019.11.05 TE CONNECTIVITY SOLUTIONS GMBH

AI summary

A contact assembly includes a contact array having contacts with transition portions between mating and terminating portions with contact tails extending to tips. The contact assembly has a dielectric contact holder holding the transition portions. The contact assembly has a solder ball module defining a board interface to a host circuit board. The solder ball module has a gathering housing with contact channels extending between a top and a bottom receiving contact tails of corresponding contacts. The gathering housing has solder balls arranged at the bottom at each contact channel being electrically connected to the tips of the contact tails and being configured to be reflow soldered to circuits of the host circuit board to electrically connect the contacts to the host circuit board.