Flexible Layered Circuit Structure for LED Heat Dissipation
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Solution Overview
Problem
LED lighting systems face challenges in heat dissipation, particularly in maintaining junction temperature below critical levels without the need for large heat sinks or secondary heat sinks, which can increase costs and constrain design flexibility.
Innovation Solution
A flexible layered circuit structure with a top thermally conductive layer, a middle electrically insulating layer, and a bottom thermally conductive layer, suspended above a housing substrate with an air gap, allowing for effective heat dissipation through the top and bottom surfaces, thereby maintaining the junction temperature within safe limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat sinks or secondary heat sinks are used for heat dissipation, then heat dissipation effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the circuit board structure with heat dissipation functionality by integrating thermally conductive layers directly into the circuit board. The circuit board serves dual purposes: electrical connection and heat dissipation, eliminating the need for separate large heat sinks. This merging of functions reduces device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: providing electrical pathways for LED connections and serving as a heat dissipation structure through its thermally conductive layers. This multi-functionality allows the same component to address both electrical and thermal management needs, reducing overall device complexity.
2Temperature
If large heat sinks or secondary heat sinks are used for heat dissipation, then heat dissipation effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
By merging heat dissipation functionality into the circuit board structure itself through thermally conductive layers, the patent eliminates the need for separate heat sink components. This reduces the total number of parts that need to be manufactured, assembled, and inventoried, thereby lowering manufacturing costs while maintaining effective heat dissipation.
Solution Approach 2:
The circuit board's dual role as both electrical connection medium and heat dissipation structure reduces the bill of materials and assembly steps. Fewer components mean lower material costs, reduced assembly time, and simplified supply chain management, all contributing to lower manufacturing costs.
3Temperature
If large heat sinks or secondary heat sinks are used for heat dissipation, then heat dissipation effectiveness is improved, but design flexibility is constrained
Solution Approach 1:
Integrating heat dissipation functionality directly into the circuit board allows for more flexible design configurations. The circuit board can be shaped and sized according to specific application requirements without being constrained by the need to accommodate separate heat sink components, enabling greater design freedom and adaptability.
Solution Approach 2:
The multi-functional circuit board that combines electrical and thermal management functions allows designers to create more versatile lighting solutions. The same structure can be adapted to different LED configurations, form factors, and application requirements, enhancing design flexibility compared to fixed heat sink designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation for LED lighting systems, maintaining junction temperatures below critical levels without the need for additional heat sinks, thus reducing costs and enhancing design flexibility while ensuring the longevity and performance of LEDs.
Implementation Method 1
dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer
Implementation Method 2
dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer
Implementation Method 3
an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate
Data Source
AI summary
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.