Module Substrate With Chamfered Corners For Component Density

Solution Overview

Problem

Existing module substrates face limitations in reducing size and weight while maintaining the number of mountable electronic components due to uniform cross-sectional areas of sub-substrates, leading to a reduced region for component mounting and increased substrate size.

Innovation Solution

The module substrate design incorporates chamfered corners and inverted L-shaped conductor portions connected to the base substrate, allowing for increased mounting regions and component density, with alternately stacked conductor and insulating portions for improved insulation and secure connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the cross-sectional area of sub-substrates is increased to securely connect them to the mother substrate, then connection reliability is improved, but the region for mounting electronic components is reduced

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmounting region area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The sub-substrates are designed with asymmetric cross-sectional shapes (rectangular, L-shaped, T-shaped, or circular) instead of uniform shapes. This allows one surface to have a larger area for secure connection to the mother substrate while the other surface maintains sufficient area for mounting electronic components, thereby resolving the contradiction between connection reliability and mounting region area.

Inventive Principle:

Principle #4Asymmetry

2Quantity of substance

If the region for mounting electronic components is increased, then the number of mountable components is increased, but the size of the module substrate must be increased

Engineering Contradiction:

Improvenumber of mountable componentsVSAvoidmodule substrate size

Core Design Contradiction:

Quantity of substanceVSArea of stationary object

Solution Approach 1:

The invention utilizes the vertical dimension by designing sub-substrates with asymmetric cross-sections where one surface extends further than the other. This allows the mounting region to be positioned in the recess area created by the asymmetric shape, effectively increasing the mounting area without increasing the overall footprint of the module substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If sub-substrates are used to connect electronic components to the mother substrate, then manufacturing is simplified and automatic mounting is enabled, but the mounting region is reduced due to uniform cross-sectional shape

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmounting region area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The sub-substrates are designed with asymmetric cross-sectional shapes (rectangular, L-shaped, T-shaped, or circular) instead of uniform shapes. This allows one surface to have a larger area for secure connection to the mother substrate while the other surface maintains sufficient area for mounting electronic components, thereby resolving the contradiction between connection reliability and mounting region area.

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS9781828B2Module substrate and method for manufacturing module substrate

Publication Date: 2017.10.03 MURATA MFG CO LTD

AI summary

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.