Solder Printing Position Deviation Compensation in Component Mounting
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Solution Overview
Problem
Existing electronic component mounting methods face challenges in achieving high productivity due to the time-consuming process of measuring solder printing positions, which delays the mounting operation and increases the risk of defects from positional deviations.
Innovation Solution
An electronic component mounting system that includes a screen printing apparatus, an electronic component mounting apparatus, a mask aperture measuring unit, and a coordinate calculating unit, where the positions of pattern holes in the screen mask are measured prior to printing to generate mask aperture data, allowing for accurate calculation of mounting coordinates and preventing defects from positional deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder printing positions are measured before component mounting operation, then mounting positional accuracy is improved, but tact-time required for mounting operation is delayed
Solution Approach 1:
The patent applies preliminary action by measuring the positions of pattern holes in the screen mask before the solder printing process. This allows the mounting apparatus to pre-calculate and store the coordinates of solder printing positions, eliminating the need for time-consuming post-printing measurements while ensuring accurate component mounting.
2Manufacturing precision
If solder printing positions are measured after screen printing, then mounting positional accuracy is improved, but productivity is reduced
Solution Approach 1:
The patent performs the measurement of pattern hole positions in advance, before the screen printing process begins. By storing the measured coordinates and using them for mounting operations, the system eliminates repeated measurements during production, thereby maintaining high precision while significantly improving productivity.
Solution Approach 2:
The patent creates a digital copy (mask aperture data) of the pattern hole positions measured from the screen mask. This digital representation is then used by the mounting apparatus to determine solder printing positions and component mounting coordinates, eliminating the need for physical remeasurement and improving both accuracy and efficiency.
3Manufacturing precision
If design is performed for solder printing positions with respect to multiple electrodes, then mounting accuracy is improved, but time required for measurement increases
Solution Approach 1:
The patent replaces manual or mechanical measurement methods with an automated optical measurement system that uses a camera to capture images of the pattern holes in the screen mask. This automated optical measurement system rapidly determines the coordinates of multiple pattern holes without time-consuming manual intervention, maintaining high accuracy while reducing measurement time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the calculation of positional deviations without post-printing measurement, ensuring accurate mounting of electronic components on solder and enhancing productivity by reducing the risk of defects caused by solder positional deviations.
Implementation Method 1
a screen printing apparatus which prints solder on electronic component connecting electrodes provided on the substrate through pattern holes provided in a screen mask, by bringing the screen mask into contact with the substrate, by supplying paste on the screen mask, and by sliding a squeegee thereon
Implementation Method 2
a mask aperture measuring unit which measures the positions of the pattern holes provided in the screen mask and outputs the measured positions as mask aperture data
Implementation Method 3
a coordinate calculating unit which calculates coordinates of mounting positions when the mounting head mounts the electronic components, on the basis of the mask aperture data
Implementation Method 4
an electronic component mounting apparatus which picks up the electronic components from a component supply unit by using a mounting head and mounts them on the substrate having the solder printed thereon
Data Source
AI summary
In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.