Interconnect Apertures for Fine Pitch Mechanical Anchoring

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Solution Overview

Problem

Existing methods for forming connections between electronic components, such as conductive adhesives and solder, face challenges in achieving a robust mechanical connection while maintaining a fine pitch, with conductive adhesives being weak and solder requiring larger spacing between conductors.

Innovation Solution

Creating apertures in an interconnect component that pass through conductive bonding pads and aligning them with corresponding pads on a substrate, followed by depositing a conductive compound into these apertures to form a mechanical and electrical connection, which can include using a system with fixtures and a controller for precise alignment and application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conductive adhesive is used to form connections, then fine pitch can be achieved, but mechanical strength is weak

Engineering Contradiction:

ImprovepitchVSAvoidmechanical connection strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The invention uses a composite structure combining conductive adhesive and solder materials. The conductive adhesive layer provides fine pitch capability while the solder material filled in apertures provides strong mechanical bonding. This composite approach allows both fine pitch and robust mechanical connection to be achieved simultaneously.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The connection structure is segmented into multiple functional zones: conductive adhesive in inter-aperture regions for fine pitch bonding, and solder material in apertures for strong mechanical anchoring. This segmentation allows each material to perform its optimal function without compromising the other.

Inventive Principle:

Principle #1Segmentation

2Strength

If solder or conductive paste is used to form connections, then mechanical strength is improved, but pitch increases

Engineering Contradiction:

Improvemechanical connection strengthVSAvoidpitch

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different materials are applied to different locations: conductive adhesive is applied in the inter-aperture regions where fine pitch bonding is needed, while solder material is applied inside the apertures where strong mechanical anchoring is required. This local differentiation allows both fine pitch and strong bonding to coexist.

Inventive Principle:

Principle #3Local quality

3Reliability

If robust mechanical connections are implemented to withstand shock loads, then reliability is improved, but device size increases

Engineering Contradiction:

Improveconnection reliability under shock loadsVSAvoidconnection size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The interconnect component incorporates apertures (porous structure) that are filled with solder material. These apertures provide anchoring points for strong mechanical bonding without significantly increasing the overall device volume. The porous structure allows robust shock load resistance while maintaining compact dimensions.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The solder material is nested within the apertures of the interconnect component, creating a space-efficient structure. The conductive adhesive is applied over the aperture regions, nesting multiple connection mechanisms within the same footprint area, thereby achieving robust connections without increasing device size.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method provides a robust mechanical and electrical connection similar to solder while maintaining the fine pitch of conductive adhesives, enhancing the reliability of connections in electronic devices subjected to shock loads.

Implementation Method 1

depositing a conductive compound along an outer surface of each of the conductive bonding pads located on the interconnect component. The conductive compound is allowed to fill each of the apertures

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS9374898B2Electrical and mechanical interconnection for electronic components

Publication Date: 2016.06.21 APPLE INC

AI summary

The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.