Modular BGA Solder Ball Shielding on PCB
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional ball grid arrays (BGAs) on printed circuit boards have irregular patterns with low solder ball density, leading to underutilization of space and requiring custom designs and extensive manpower for verification, as the arrangement of grounded solder balls for shielding is not standardized.
Innovation Solution
A regulated BGA design featuring multiple solder ball modules with specific grounding configurations, such as one grounded solder ball shielding two others and one penetrating the board, allowing for a more efficient use of space and reduced manpower in verification, with ratios of signal to grounded solder balls optimized for shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If solder balls are arranged in a scattered manner with low density, then the arrangement can be flexible and adapted to different chips, but the usable area of the printed circuit board is under-utilized
Solution Approach 1:
The BGA is divided into multiple modules, each containing a specific arrangement of signal solder balls and ground solder balls. This modular segmentation allows the design to be systematically replicated while efficiently utilizing the printed circuit board area, resolving the contradiction between flexibility and space utilization.
Solution Approach 2:
The patent creates a universal module design that can be repeatedly used across different BGA configurations. By establishing a standardized module with specific grounding patterns, the design achieves both adaptability to different chips and efficient space utilization through repetition and standardization.
2Adaptability or versatility
If custom design of BGA is used for different chips, then the design can be optimized for specific applications, but manpower is required for verifying the performance of each BGA
Solution Approach 1:
Instead of creating entirely custom designs for each BGA application, the patent uses a standardized module that can be copied and replicated. This module contains pre-verified grounding patterns and signal arrangements, eliminating the need for repeated verification while maintaining application-specific optimization through modular configuration.
3Reliability
If more ground solder balls are used for shielding, then the shielding performance is improved, but the area occupied by the BGA increases
Solution Approach 1:
The patent implements localized grounding by placing ground solder balls in specific positions within each module rather than uniformly distributing them. The grounding pattern is concentrated where it provides maximum shielding effectiveness, allowing optimal shielding performance with minimal ground solder ball count and reduced area occupation.
Data Source
AI summary
A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.