LED Array Substrate with Segmented Heat Dissipation Pattern
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Solution Overview
Problem
The increasing demand for higher brightness in LED applications, particularly in daily life and emergency signal lamps, poses a challenge as existing LED technologies struggle to efficiently manage heat dissipation, which affects the reliability and performance of light emitting devices.
Innovation Solution
A light emitting device array is designed with a substrate that includes a metal layer and a heat dissipation pattern, insulated from the electrode patterns, which absorbs and dissipates heat generated from the light emitting device packages, improving thermal management and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED brightness is increased to meet higher illumination requirements, then illumination intensity is improved, but heat generation increases causing reliability to deteriorate
Solution Approach 1:
The metal layer is segmented into distinct functional patterns: electrode patterns for electrical connection and a separate heat dissipation pattern for thermal management. This segmentation allows the heat dissipation pattern to be optimized specifically for thermal performance without compromising electrical functionality, enabling higher LED brightness while maintaining reliability through dedicated heat removal pathways.
Solution Approach 2:
The heat dissipation pattern acts as an intermediary between the heat-generating LED packages and the base layer. It absorbs heat from the LED packages and transfers it to the base layer for dissipation, serving as a thermal mediator that protects the LED devices from excessive heat while enabling sustained high-brightness operation.
2Device complexity
If conventional substrate structures are used without dedicated heat dissipation features, then device complexity is reduced, but heat dissipation capability deteriorates affecting performance
Solution Approach 1:
The metal layer performs multiple functions simultaneously: it provides electrical connection through electrode patterns and heat dissipation through the heat dissipation pattern. This multi-functionality allows a single substrate structure to address both electrical and thermal requirements without adding separate complex components, maintaining manufacturing simplicity while achieving effective heat management.
Solution Approach 2:
The substrate employs a composite structure combining a base layer with a metal layer that has distinct functional regions. The metal layer's dual-function design (electrical + thermal management) creates a composite material system that achieves superior heat dissipation capability while maintaining structural integrity and electrical functionality without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the heat dissipation capabilities of LED arrays, leading to improved reliability and performance by maintaining higher brightness and efficiency in LED applications.
Implementation Method 1
a heat dissipation pattern insulated from at least one of the first or (and) second electrode patterns, absorbing heat generated from the base layer and the light emitting device packages and then dissipating the heat
Data Source
AI summary
Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat.