Embedded Tamper Sensor Circuit Board for Secure Testing
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Solution Overview
Problem
Tamper-proof electronic packages with security sensors wrapped around enclosures are difficult to test and recover components from, due to the presence of the security sensor, which complicates manufacturing defect detection and component recovery.
Innovation Solution
A multilayer circuit board with a tamper-respondent sensor embedded within, featuring multiple tamper-respondent layers that define a secure volume, including a picture frame-type layer and a mat layer, to facilitate secure electronic component protection and tamper detection, allowing for easier testing and component recovery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a security sensor is wrapped around an enclosure to provide tamper protection, then the security and reliability of the electronic package is improved, but the ease of testing and component recovery deteriorates
Solution Approach 1:
The security sensor is divided into multiple discrete layers (first sensor layer, second sensor layer, third sensor layer) that can be separately positioned and connected within the circuit board structure. This segmentation allows the sensor to maintain its tamper-detection function while enabling selective access to different portions of the sensor and underlying components for testing and recovery operations.
Solution Approach 2:
The sensor layers are nested within the multilayer circuit board structure, with sensor layers positioned between functional circuit layers. The conductive traces of the sensor are connected to contact pads on the board's surface through vias, creating a nested configuration where the sensor is embedded yet accessible. This nesting allows the sensor to provide comprehensive tamper protection while enabling testing and component recovery through the board's contact pads.
2Reliability
If a security sensor is wrapped around an enclosure, then tamper detection capability is improved, but the device complexity increases
Solution Approach 1:
The multilayer circuit board serves multiple functions: it provides structural support for electronic components, establishes electrical connections between components, and embeds the security sensor layers to provide tamper detection. By integrating the sensor function into the existing multilayer board structure rather than adding a separate wrapping structure, the patent achieves comprehensive tamper detection while minimizing additional device complexity.
Solution Approach 2:
The security sensor is merged with the multilayer circuit board structure, where sensor layers are combined with functional circuit layers within the same board. The conductive traces of the sensor share the board's internal vias and contact pads with functional circuits, creating a unified structure that provides both computing functionality and security monitoring without requiring separate sensor packaging.
Data Source
AI summary
Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.