Modular Sub-Circuit Arrangement for Thermal Management

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Solution Overview

Problem

The increasing complexity and integration of electronic circuits lead to reduced reliability, heat dissipation challenges, and increased costs due to heat loss and warping issues in power electronic circuits, particularly with cyclic thermal loading and high operating temperatures.

Innovation Solution

The method involves producing multiple sub-circuits on separate insulating carriers, which are then arranged side by side on a common carrier and electrically connected using a metallic layer for surface contacting, allowing for improved heat dissipation and reduced material fatigue, while also simplifying the manufacturing process and reducing cooler requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If increasing integration of electronic components on a substrate is implemented, then more electronic components can be accommodated on the circuit carrier, but the circuit size increases and reliability decreases due to fatigue at interfaces under cyclic thermal loading

Engineering Contradiction:

Improvenumber of electronic componentsVSAvoidreliability of circuit

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The circuit carrier is divided into multiple separate insulating substrates, each carrying a subset of electronic components. These substrates are arranged side by side and electrically connected through conductive structures. This segmentation allows each substrate to be smaller and more reliable while collectively accommodating a large number of components, thus resolving the contradiction between component quantity and reliability.

Inventive Principle:

Principle #1Segmentation

2Quantity of substance

If increasing integration of power electronic components is implemented, then more components can be placed on the substrate, but heat dissipation becomes more difficult and temperature limits are exceeded

Engineering Contradiction:

Improvenumber of power electronic componentsVSAvoidtemperature of power electronic components

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

Power electronic components are distributed across multiple separate insulating substrates arranged side by side. Each substrate manages a portion of the heat load independently, allowing for better thermal management. The conductive structures connecting the substrates also serve as heat dissipation pathways, enabling effective heat removal while accommodating more power components overall.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of stacking power components vertically on a single substrate, the invention distributes them horizontally across multiple substrates arranged side by side. This dimensional redistribution increases the total surface area available for heat dissipation and allows better thermal management while accommodating more power electronic components.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If larger substrate size is used to accommodate more components, then integration increases, but warping occurs at high temperatures making heat dissipation more difficult

Engineering Contradiction:

Improvenumber of components on substrateVSAvoidwarping of substrate

Core Design Contradiction:

Quantity of substanceVSShape

Solution Approach 1:

The large substrate is segmented into multiple smaller insulating substrates arranged side by side. Each smaller substrate is less prone to warping under thermal stress compared to a single large substrate. The modular arrangement maintains the overall integration capacity while significantly reducing warping issues and improving heat dissipation.

Inventive Principle:

Principle #1Segmentation

4Quantity of substance

If larger substrate size is used for higher integration, then more components are accommodated, but mechanical connection requirements with cooler increase and production costs rise

Engineering Contradiction:

Improvenumber of components on substrateVSAvoidmechanical connection requirements

Core Design Contradiction:

Quantity of substanceVSEase of manufacture

Solution Approach 1:

The circuit is divided into multiple smaller substrate modules that can be manufactured independently with standard cooling connections. Each module has simpler mechanical connection requirements with coolers compared to a single large substrate. The modular design facilitates easier assembly and manufacturing while maintaining high component integration through the side-by-side arrangement of multiple modules.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and efficiency of electronic circuits by reducing material fatigue, improving heat dissipation, and lowering production costs through modular design and efficient heat management, particularly beneficial for power electronic circuits with high operating temperatures.

Implementation Method 1

The method for surface contacting comprises at least the deposition of a metallic layer

Methodology Applied

Scientific EffectDeposition (physical): Deposition (physical)

Data Source

PatentEP2203937B1Method for producing an electronic circuit composed of sub-circuits

Publication Date: 2018.11.14 SIEMENS AG

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AI summary

The invention relates to an electronic circuit. In order to improve manufacture thereof, the electronic circuit is composed of modules of sub-circuits that are arranged on a common substrate, such as a cooling body, and that are electrically interconnected by means of a planar electrical contact element.