Circuit Board Convex Post Manufacturing Method

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing circuit boards face challenges in preventing contact between post portions and circuit patterns during manufacturing, which can lead to short-circuits and design limitations.

Innovation Solution

A method for manufacturing a circuit board involves providing a first board with a post portion and a second board with an opening portion, using an adhesive member to bond them together by pressurizing and heating, ensuring the post portion is inserted into the opening portion with the adhesive member disposed between the post portion and the second board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the post portion is directly bonded to the wiring board during manufacturing, then the manufacturing process is simplified, but the post portion may contact the circuit pattern causing short-circuits

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidshort-circuit prevention
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a convex-shaped protrusion on the post portion as an intermediary structural element that extends into the opening portion of the wiring board. This protrusion acts as a mediator between the post portion and the circuit pattern, physically preventing direct contact while maintaining the bonding function. The protrusion's convex shape allows it to engage with the opening portion without touching the circuit pattern, thus resolving the contradiction between manufacturing simplicity and short-circuit prevention.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the post portion is inserted deeply into the opening portion to prevent contact with circuit pattern, then short-circuit prevention is improved, but the structural stability and bonding strength are reduced

Engineering Contradiction:
Improveshort-circuit preventionVSAvoidbonding strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies partial action by designing the protrusion to extend only partially into the opening portion, rather than completely through it. The protrusion's height is carefully controlled to reach a position where it prevents contact with the circuit pattern but does not extend excessively deep. This partial insertion provides just enough separation to prevent short-circuits while maintaining adequate bonding strength between the post portion and the wiring board.

Inventive Principle:
Principle #16Partial or excessive action

3Ease of operation

If the opening portion is made larger to facilitate post insertion, then ease of assembly is improved, but the precision of post positioning relative to circuit pattern is reduced

Engineering Contradiction:
Improvepost insertion easeVSAvoidpost positioning precision
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent segments the opening portion into functional zones: an upper wider section that facilitates easy insertion of the post portion, and a lower narrower section that provides precise positioning. The convex-shaped protrusion on the post portion corresponds to this segmented opening structure, allowing the post to be easily inserted through the wider upper section while the lower section constrains the final position to prevent contact with the circuit pattern. This segmentation resolves the contradiction between ease of assembly and positioning precision.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively prevents contact between the post portion and the circuit pattern, enhancing design flexibility and preventing short-circuits, while also improving heat dissipation and manufacturing efficiency.

Implementation Method 1

the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

pressurizing and heating the first board and the second board

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

bonding the first board and the second board using the adhesive member

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS12309934B2Circuit board with convex shaped post, light emitting device, and manufacturing method therefor
Publication Date: 2025.05.20 NICHIA CORP
  • US12309934B2 patent drawing
  • US12309934B2 patent drawing
  • US12309934B2 patent drawing

AI summary

A method for manufacturing a circuit board includes: providing a first board including a post portion, and a second board defining an opening portion extending through a base material, the base material including a circuit pattern disposed on a first surface and an adhesive member disposed on a side of a second surface; and bonding the first board and the second board using the adhesive member by pressurizing and heating the first board and the second board in a state of the post portion being inserted in the opening portion and a top surface of the post portion being exposed from the second board. In a plan view, the second board includes a base material exposed portion. In the bonding, the adhesive member melted by the pressurizing and the heating is disposed between a lateral surface of the post portion and the second board.