Carrier Substrate with Segmented Metal Patterns for Semiconductor Interposer Flatness
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Solution Overview
Problem
The existing methods for manufacturing semiconductor packages with interposers face challenges in achieving fine pad pitches and preventing carrier separation during the fabrication process, especially when using glass or organic materials, which are difficult to miniaturize and costly to produce.
Innovation Solution
A carrier substrate with a separation prevention design is introduced, featuring a core layer and patterned metal and release layers, allowing for the formation of unit pattern portions with smaller areas than the core layer, which helps prevent delamination and separation during the cutting process, enabling the production of semiconductor packages with improved flatness and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If glass or organic materials are used for interposer to reduce cost and increase size, then manufacturing cost decreases and interposer size increases, but manufacturing precision and flatness deteriorate
Solution Approach 1:
The patent uses a composite structure combining glass core layer with organic resin layers (prepreg and mold resin) to create an interposer that maintains the flatness of glass while reducing overall cost and enabling larger sizes. The glass core provides structural stability and flatness, while the organic layers provide cost benefits and ease of manufacturing.
2Manufacturing precision
If carrier is cut into quad size to improve package process quality, then package process quality improves, but carrier separation occurs
Solution Approach 1:
The patent segments the interposer into multiple independent units (first, second, third, and fourth interposers) arranged in a quad configuration on the carrier. This segmentation allows the carrier to be cut into separate packages while each interposer unit maintains its structural integrity and prevents carrier separation during the cutting process.
Solution Approach 2:
The patent performs preliminary arrangement and fixation of multiple interposer units on the carrier before the cutting process. The interposers are pre-positioned and secured on the carrier substrate, ensuring they remain stable and prevent carrier separation during subsequent cutting operations to improve package process quality.
3Manufacturing precision
If fine circuit line is miniaturized to achieve fine pad pitch, then pad pitch decreases, but carrier flatness requirements increase
Solution Approach 1:
The patent employs a composite structure with a glass core layer providing superior flatness, which is critical for achieving fine pad pitches of several micrometers. The glass substrate maintains high flatness over the required area, enabling the fabrication of fine circuit lines while the organic layers provide cost benefits and ease of manufacturing.
Data Source
AI summary
A carrier substrate includes a core layer, a first metal layer disposed on the core layer, and a plurality of unit pattern portions disposed on the first metal layer. The plurality of unit pattern portions each have a planar area smaller than a planar area of the first metal layer. The plurality of unit pattern portions each include a second metal layer disposed on the first metal layer, a release layer disposed on the second metal layer, and a third metal layer disposed on the release layer.