Insulating Substrate Metal Adhesion Improvement TRIZ Cases

A wiring-forming member uses a dual-region adhesive layer to bond metal layers and conduct electricity simultaneously.

Embedded glass fiber layer within plastic film prevents peeling during polishing, ensuring reliable adhesion in stacked multilayer circuit structures.

Mechanically drilled vias filled with conductive compound replace sequential plating, eliminating residual dimples and reducing manufacturing costs.

Surface-treated copper foil with a zinc-containing layer bonds fluororesin substrates for high-frequency printed wiring boards.

An oxide layer formed with fluorine and an oxide precursor enhances adhesion of electroless nickel-phosphorus plating films to smooth glass substrates.

A polyallylamine layer bonds the lead conductor to the sealable container in nonaqueous electrolyte cells.

A two-stage surface treatment forms an anchor structure and a black oxide layer on printed circuit board metal patterns.

A surface-treated copper foil with a multi-layer oxide coating and coupling agent.

A silicon-based surface coating layer enhances bonding strength on smooth copper foils.

A spinel-structure interface layer with dispersed copper crystal grains resolves weak adhesion and high manufacturing costs in electronic component production.

Extruding powder polytetrafluoroethylene with spherical silica below the melting point reduces linear expansion coefficient and thickness variations.

Replacing unstable silane agents, the polymer uses carbodiimide groups to prevent aggregation while maintaining catalyst capture for reliable plating.

A resin film modified layer containing metal ions improves adhesion between the metal layer and substrate.

Silane coating layer bonds insulating and metal layers via hydrogen bonding and coordination, reducing signal transmission loss while maintaining adhesion.

Hot isostatic pressing eliminates micro-cavities in metal-ceramic connections, enhancing partial discharge resistance.

Titanium and copper layers support low-phosphorus nickel plating on glass substrates, reducing cracking susceptibility while maintaining adhesion.

Thiol-based aqueous acidic treatment joins resist coatings to copper without etching, preserving thin layer integrity during fine line manufacturing.

Organic acid etching minimizes copper removal while forming an oxide layer that improves resist adhesion for ultra-fine circuitry.

Segmented unit pattern portions on a carrier substrate prevent delamination and carrier separation, enabling fine pad pitch manufacturing.

An insulation layer with varying arithmetic mean roughness improves wiring adhesion while preventing electrical characteristic deterioration.

Laminates sub-circuit boards with alternating conductive through-holes to create direct electrical connections without solder or underfill.

Oriented copper plate uses chromium precipitates to increase strength and breaking elongation.

Phenolic curing agents replace amine systems to resolve adhesive force versus heat resistance trade-offs in ultra-thin HDI substrates.

A flexible circuit board substrate layer features a guiding structure that directs colloid flow during lamination.

A projected electrode with a flat distal end protrudes from molding resin to enable reliable three-dimensional mounting connections.

A printed circuit board substrate uses conductive ink and non-electrolytic plating to form a metal layer on a base film containing group 10 transition metals.

Matching ceramic substrate and metal layer thermal expansion suppresses base plate warping during heating cycles.

Nanometer plating layers on circuit metal surfaces enhance junction adhesion, eliminating reserved width constraints to increase circuit density.

Crystalline thermoplastic polyimide adhesive layers prevent swelling during high-temperature soldering, ensuring reliable post-moisture absorption performance.

Coating synthetic liquid TFP film on cured polyimide substrate reduces signal transmission loss and moisture absorption for 5G technology products.

A UV-curable interlayer composition enables rapid room-temperature curing of printed electronic circuits.

Segmenting the insulating resin into rough and smooth layers resolves adhesion versus precision trade-offs, preventing electric short-circuits.

An asymmetric tapered etching mask opening prevents wiring path disconnection by limiting seed layer exposure when arrangement errors shift the mask position.

A flexible metal-cladded base material uses a polyamide-imide resin layer to improve adhesion and eliminate surface treatments.

Copper deposition on alloy surfaces creates micron-scale concavities that anchor resin compositions, eliminating the need for adhesive layers.

Composite resin composition bonds 6 μm copper foil, resolving adhesion deterioration during reflow thermal treatment.

Optimized nitrogen, carbon, and silicon concentrations in the surface layer suppress blister formation during reflow soldering thermal loads.

An adhesion promoting layer enhances bonding between conductive and dielectric surfaces.

Titanium, copper, and aluminum layers enable epitaxial growth on clean interfaces to maintain substrate purity during lift-off processing.