Resin Surface Modification for Fine Metal Wiring
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Solution Overview
Problem
Existing methods for forming metal films on resin products, such as those used in printed circuit boards, face challenges including high signal loss due to roughened surfaces, misalignment of patterns during ultraviolet light irradiation, and inefficiencies in surface modification processes, which lead to increased costs and environmental impact.
Innovation Solution
A method involving multiple surface modification processes using different techniques, including ultraviolet laser irradiation and oxidation, to selectively deposit metal on resin products, eliminating the need for photolithography and etching steps, thereby reducing signal loss and misalignment while improving adhesion and reducing processing time and waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate surface is roughened to improve adhesion, then adhesion is improved, but signal loss increases due to skin effect in high-frequency region
Solution Approach 1:
The patent applies different surface treatment methods to different regions of the substrate. The first surface treatment creates roughness for adhesion in specific areas, while the second surface treatment smooths the surface to reduce signal loss. This local differentiation allows each region to have optimized properties for its specific function.
Solution Approach 2:
The surface modification process is divided into multiple sequential steps with different treatment methods. The first modification process addresses adhesion requirements, while the second modification process addresses signal loss requirements. This segmentation allows independent optimization of each function without compromise.
2Ease of manufacture
If ultraviolet light is irradiated to modify surface for electroless plating, then plating capability is improved, but misalignment of patterns occurs
Solution Approach 1:
The patent replaces conventional ultraviolet light irradiation with a laser-based surface treatment system. The laser can be precisely controlled and positioned to treat only specific patterns on the substrate, eliminating the misalignment problem associated with conventional UV irradiation while maintaining the ability to create plating-ready surfaces.
Solution Approach 2:
The patent changes the parameters of the surface treatment process by using laser irradiation instead of conventional UV light. This parameter change enables precise pattern definition and eliminates the misalignment issue while maintaining the chemical modification necessary for electroless plating.
3Reliability
If conventional plating methods are used, then metal film formation is achieved, but processing time and cost increase
Solution Approach 1:
The patent performs preliminary surface modification using laser irradiation to create the exact pattern and chemical state needed for plating before the actual plating process. This preliminary action eliminates the need for subsequent pattern transfer and alignment steps, significantly reducing total processing time while ensuring reliable metal film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of fine metal wiring patterns on resin products with reduced costs, environmental impact, and improved accuracy, allowing for efficient and precise metal film deposition without the need for complex patterning steps.
Implementation Method 1
irradiating the portion with an ultraviolet laser having a wavelength of not more than 243 nm
Implementation Method 2
oxidizing a region including the portion after the irradiating to modify the portion
Implementation Method 3
oxidizing a region including the portion after the irradiating to modify the portion such that a plating metal can be deposited on the portion
Implementation Method 4
a metal film is formed by performing electroless plating on the whole modified surface
Data Source
AI summary
There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.