Segmented Circuit Board Structure with Alternating Through-Holes
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Solution Overview
Problem
Large circuit boards with higher area sizes experience stress and warpage during high-temperature reflow, leading to reduced assembly yield when connected via solder-free blocks with underfill, which increases costs and reliability issues.
Innovation Solution
A circuit board structure and manufacturing method that eliminates the use of solder and underfill by laminating sub-circuit boards with alternately arranged conductive through holes, allowing for electrical connections without the need for solder or underfill, thereby reducing costs and improving bonding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder-free block with underfill is used to connect circuit boards, then assembly cost increases and structural reliability deteriorates, but electrical connection between circuit boards is achieved
Solution Approach 1:
The circuit board is divided into multiple sub-circuit boards that are connected through conductive through-holes. This segmentation eliminates the need for solder-free blocks and underfill, directly resolving the technical contradiction by achieving both cost reduction and improved structural reliability through direct mechanical and electrical integration.
Solution Approach 2:
Conductive through-holes are formed by nesting multiple layers (first, second, and third sub-circuit boards) with alternating arrangements. This nested structure allows electrical connections to pass through multiple layers while maintaining mechanical strength, eliminating the need for additional connection components and improving overall structural reliability.
2Manufacturing precision
If high-temperature reflow is applied to solder-free block assembly, then electrical connection is achieved, but warpage increases and assembly yield decreases
Solution Approach 1:
The assembly is segmented into multiple sub-circuit boards with alternating conductive through-holes. This segmentation allows for distributed stress during high-temperature reflow, preventing the concentration of thermal stress that causes warpage in large-area assemblies, thereby improving assembly yield while maintaining electrical connection integrity.
Solution Approach 2:
Conductive through-holes are strategically arranged in alternating patterns across different layers. This local quality distribution creates a balanced thermal and mechanical structure that compensates for warpage during high-temperature reflow, enabling successful assembly while maintaining precise electrical connections.
3Area of stationary object
If large area circuit boards are assembled, then functional requirements are met, but stress and warpage increase during high-temperature reflow
Solution Approach 1:
Large area circuit boards are segmented into multiple sub-circuit boards connected through conductive through-holes. This segmentation maintains the overall large area functionality while distributing thermal stress across multiple smaller units, preventing excessive warpage and improving assembly stability during high-temperature reflow processes.
Solution Approach 2:
The assembly structure transitions from a planar two-dimensional arrangement to a three-dimensional stacked configuration with alternating conductive through-holes. This dimensional change allows large area circuit boards to be assembled with improved stability by distributing stress across multiple layers and depth dimensions, reducing warpage during high-temperature reflow.
Data Source
AI summary
A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.