Photosensitive Polymer for Electroless Plating Adhesion
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Solution Overview
Problem
Conventional silane coupling agents used for electroless plating have low temporal stability due to high reactivity, leading to aggregation, suspension, and degradation of deposition properties.
Innovation Solution
A polymer compound with a photosensitive leaving group is used to form a stable and adhesive layer for electroless plating, replacing traditional silane coupling agents, which includes specific structural units and is synthesized through controlled radical polymerization methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silane coupling agents are used to capture catalysts for electroless plating, then deposition properties are achieved, but temporal stability deteriorates due to condensation reactions with water
Solution Approach 1:
The patent changes the chemical structure parameters of the coupling agent by replacing silane groups with carbodiimide groups that have different reactivity characteristics. The carbodiimide group reacts with carboxyl groups on the substrate to form stable amide bonds, avoiding the hydrolysis and condensation issues of silane groups while maintaining catalyst capture ability.
Solution Approach 2:
The patent creates a composite surface treatment layer by combining carbodiimide-containing coupling agents with specific functional groups that can capture catalysts. This composite approach integrates substrate adhesion (via carbodiimide-carboxyl reaction) and catalyst immobilization (via amino or other functional groups) into a single stable layer.
2Reliability
If silane coupling agents with high reactivity are used, then catalyst capture ability is improved, but aggregation and suspension occur due to condensation reactions
Solution Approach 1:
The patent modifies the chemical parameters by selecting carbodiimide groups instead of silane groups. The carbodiimide group reacts specifically with carboxyl groups on the substrate surface to form stable covalent bonds, providing catalyst capture ability without undergoing hydrolysis-induced aggregation that plagues silane-based systems.
3Productivity
If conventional surface treatment agents are used, then electroless plating is achieved, but adhesion to substrate deteriorates due to peeling and dissolution
Solution Approach 1:
The patent changes the chemical bonding parameters by using carbodiimide groups that form stable amide bonds with substrate carboxyl groups. This covalent bonding mechanism provides superior adhesion strength compared to conventional surface treatment agents, preventing peeling and dissolution while maintaining electroless plating capability.
Solution Approach 2:
The carbodiimide-containing coupling agent acts as an intermediary layer between the substrate and the electroless plating catalyst. It provides both strong adhesion to the substrate (via carbodiimide-carboxyl bonding) and catalyst capture ability (via amino or other functional groups), mediating the interface to prevent peeling and dissolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer compound provides excellent stability and adhesion to substrates, enabling high-quality electroless plated wiring with improved patterning and resistance to environmental factors, reducing the risk of peeling or dissolution in plating baths.
Implementation Method 1
exposing the photosensitive polymer layer to predetermined pattern light
Implementation Method 2
the polymer compound provides excellent stability and adhesion to substrates
Implementation Method 3
bringing the photosensitive polymer layer into contact with an electroless plating solution, thereby carrying out electroless plating
Data Source
AI summary
Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].