Laminate Adhesion via Primer Layer and Insulating Resin
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Solution Overview
Problem
Existing conductive patterns for electronic circuits face issues with adhesion between the support and conductive layers, leading to disconnection and conductivity degradation, especially in high-temperature and high-humidity environments, and current methods to enhance adhesion result in increased thickness or require additional insulating layers.
Innovation Solution
A laminate structure comprising a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer, where the insulating layer is formed by coating a resin composition on the first conductive layer and drying it, and the second conductive layer includes a second plating seed layer and plating layer, enhancing adhesion and resistance to humidity and heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a latex layer or ink-receiving substrate is formed to enhance adhesion between the support and conductive substance, then adhesion is improved, but the laminate thickness increases and adhesion is still insufficient in high-temperature and high-humidity environments
Solution Approach 1:
The patent changes the chemical composition parameters of the primer layer, specifying it contains at least one compound selected from isocyanate compounds, carboxylic acid compounds, phenolic compounds, or ammonium compounds. This chemical parameter change enables strong adhesion without increasing thickness, as the primer layer forms a molecular-level bond between the support and conductive substance rather than relying on physical thickness.
Solution Approach 2:
The patent creates a composite structure where the primer layer acts as a chemical bridge between the support and conductive substance. The primer layer is formulated as a composite containing specific functional compounds that create strong interfacial bonding, replacing the need for thick latex or ink-receiving layers while maintaining or improving adhesion reliability.
2Reliability
If a film-shaped insulating layer or primer layer is added between conductive layers to enhance adhesion, then adhesion is improved, but the electronic circuit thickness becomes excessively large
Solution Approach 1:
The patent specifies that when an insulating layer is present between conductive layers, its thickness should be 1 μm to 100 μm. This parameter control allows the insulating layer to provide necessary electrical isolation and adhesion functionality while minimizing thickness increase, enabling multi-layer conductive patterns without excessive overall thickness.
Solution Approach 2:
The insulating layer serves multiple functions simultaneously: it provides electrical isolation between conductive layers, maintains structural integrity, and enhances adhesion when formulated with appropriate compounds. This multi-functionality eliminates the need for separate primer layers, reducing overall thickness while improving reliability.
3Length of stationary object
If conventional conductive patterns are used without sufficient adhesion enhancement, then the structure remains simple and thin, but the conductive substance separates from the support over time causing disconnection and conductivity degradation
Solution Approach 1:
The patent applies a primer layer before forming the conductive substance layer. This preliminary action prepares the support surface with specific chemical functional groups that enhance subsequent adhesion of the conductive substance. The primer layer is applied in advance and allowed to dry or cure, creating a prepared surface that ensures long-term conductivity stability without requiring thick protective layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate maintains high adhesion and conductivity even in harsh environments, enabling its use in various electronic applications without thickness increase or disconnection, and allows for efficient production of thin, reliable conductive patterns.
Implementation Method 1
the insulating layer (D) is formed by coating at least a portion of or entirety of a surface of the first conductive layer (C) with a resin composition (d) and drying the resin composition (d)
Implementation Method 2
coating a surface of a support with a conductive ink or a plating nucleating agent containing a conductive substance such as silver and firing the coated substance to form a conductive substance layer
Implementation Method 3
subsequently by plating the surface of the conductive substance layer to form a plating layer on the surface of the conductive substance layer
Data Source
AI summary
The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.