Copper Electrode Adhesion on Inorganic Substrate via Spinel Interface
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Solution Overview
Problem
Existing methods for forming copper electrodes on inorganic material substrates, such as electroless plating and copper paste compositions, face issues with adhesion strength and manufacturing costs, and fail to ensure dynamic durability under strict environmental conditions.
Innovation Solution
A method involving the formation of an interface layer containing copper, manganese, silicon, and oxygen between the substrate and copper electrode, with copper crystal grains dispersed within, enhancing adhesion through a spinel-structure intermediate phase and anchor-like crystal grains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional methods (electroless plating or copper paste) are used to form copper electrodes on inorganic substrates, then the manufacturing process is simple, but the adhesion strength between copper and substrate is insufficient causing easy peeling
Solution Approach 1:
An interface layer comprising a first region and a second region is introduced between the copper electrode and the inorganic substrate. The first region contains copper atoms that form strong bonds with the copper electrode, while the second region contains elements that bond strongly with the inorganic substrate, serving as an intermediary structure that resolves the adhesion problem.
Solution Approach 2:
The interface layer is designed with different compositional regions: the first region has high copper content for strong copper-copper bonding, while the second region has different elemental composition optimized for bonding with the specific inorganic substrate material, providing locally optimized properties for each bonding interface.
2Strength
If electroless plating with post-plating process or copper paste with multiple copper raw materials and Pd compound is used, then adhesion is improved to some extent, but the manufacturing cost increases significantly
Solution Approach 1:
The interface layer formation process utilizes controlled atomic diffusion and phase separation during cooling, changing the thermal and compositional parameters to naturally create the desired bimodal structure without requiring expensive post-plating processes or multiple copper raw materials.
Solution Approach 2:
The invention replaces expensive materials like Pd compounds and complex multi-material pastes with a simpler copper-based alloy composition that achieves comparable or superior adhesion through controlled interface layer formation, significantly reducing material costs.
3Reliability
If existing interface layer methods (copper alloy film with oxygen, Mn, Ag or aggregated zones) are used, then some adhesion improvement is achieved, but dynamic durability under strict environmental conditions is not sufficiently ensured
Solution Approach 1:
The interface layer is designed as a composite structure with a first region containing copper atoms for metal bonding and a second region containing elements with affinity to the inorganic substrate, creating a composite material system that provides both strong adhesion and enhanced dynamic durability under environmental stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interface layer significantly improves the adhesion strength between the inorganic substrate and copper electrode, enabling efficient and cost-effective manufacturing of electronic components with enhanced durability.
Implementation Method 1
the interface layer contains copper crystal grains dispersed therein
Data Source
Figure 1(1)~1(4)
Figure 2
Figure 3
AI summary
To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.