Laminate Circuit Board Nanometer Plating Layer Adhesion
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Solution Overview
Problem
Existing laminate circuit boards with multi-layer circuit structures require reserved circuit width due to roughening processes, limiting circuit density and design flexibility, especially in denser applications.
Innovation Solution
A laminate circuit board design featuring smooth surfaces with nanometer plating layers (Ra<0.35 μm and Rz<3 μm) that eliminate the need for surface roughening, allowing for increased circuit density by using a substrate with a first and second circuit metal layer, nanometer plating layers, and a cover layer for improved adhesion and electrical connectivity without reserved circuit width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface roughening is applied to the circuit metal layer, then junction adhesion is improved, but circuit width must be reserved for compensation, reducing circuit density
Solution Approach 1:
The invention changes the surface roughness parameter from conventional values (Ra≥0.35μm) to nanometer-level smooth surfaces (Ra<0.35μm, Rz<3μm). This parameter change eliminates the need for circuit width compensation while maintaining junction adhesion through the nanometer plating layer, thereby resolving the contradiction between adhesion strength and circuit width
Solution Approach 2:
The invention applies a composite structure consisting of the circuit metal layer combined with a nanometer plating layer. This composite material approach provides both the adhesion benefits of surface treatment and the smooth surface needed for high circuit density, as the nanometer plating layer acts as an intermediate that enhances bonding without requiring roughening
2Reliability
If circuit width is reserved for compensation, then junction adhesion is maintained, but circuit density is reduced
Solution Approach 1:
By changing the surface roughness parameter to nanometer-level smoothness (Ra<0.35μm), the invention eliminates the need for compensation width while maintaining junction reliability. The nanometer plating layer compensates for the lack of mechanical interlocking that would normally result from rough surfaces
Solution Approach 2:
The nanometer plating layer creates a refined copy or representation of the surface structure at the nanoscale, providing sufficient bonding interface area without macroscopic roughness. This allows the circuit to achieve both reliability and high density by operating at a different scale
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances junction adhesion and eliminates the need for reserved circuit width, enabling higher circuit density and more flexible multi-layer circuit structures without compromising electrical connectivity.
Implementation Method 1
a first nanometer plating layer covering the first circuit metal layer, and a second nanometer plating layer covering the second circuit metal layer
Data Source
AI summary
A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.