Flexible Circuit Board Guiding Structure for Display Lamination
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Solution Overview
Problem
The narrow bezel design in liquid crystal display panels makes it difficult to separate the display panel from the glass substrate during lamination, leading to a decreased yield rate due to the anisotropic conductive film flowing to the edge and causing connection issues.
Innovation Solution
A flexible circuit board with a guiding structure on its substrate layer and a colloid layer containing charged particles, which directs the flow of the anisotropic conductive film during heat melting, preventing it from reaching the edges and ensuring proper separation and connection between the display panel and the glass substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit board is laminated onto the display panel with anisotropic conductive film, then the electrical connection between the display panel and integrated circuit is achieved, but the colloid flows to the edge area during heating and causes the display panel to be difficult to separate from the glass substrate
Solution Approach 1:
The substrate layer is divided into a lamination area and a non-lamination area. The lamination area contains the guiding structure (protrusions or recesses) that segments the colloid flow path, preventing colloid from reaching the edge area while maintaining electrical connection functionality in the lamination zone.
Solution Approach 2:
The guiding structure acts as an intermediary element between the colloid layer and the edge area of the display panel. The protrusions or recesses in the guiding structure serve as physical barriers that mediate the colloid flow, directing it away from the edges during the heating process.
2Productivity
If the colloid layer is heated to melt the anisotropic conductive film, then the lamination and electrical connection are achieved, but the melted colloid flows to the edge area and causes manufacturing defects
Solution Approach 1:
The guiding structure is pre-formed in the substrate layer before the lamination process. The protrusions or recesses are prepared in advance to control the colloid flow path, ensuring that when heating occurs, the colloid is automatically directed away from the edge area without requiring additional control measures.
Solution Approach 2:
The substrate layer is designed with different properties in different areas: the lamination area has the guiding structure with protrusions or recesses to control colloid flow, while the non-lamination area maintains standard properties. This local differentiation allows precise control of colloid flow exactly where needed during heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The guiding structure effectively manages the flow of the anisotropic conductive film, increasing the yield rate of the display panel by preventing unwanted connections and facilitating easy peeling, thus enhancing the manufacturing efficiency.
Implementation Method 1
when the colloid layer is melted by heat
Implementation Method 2
guide a flow direction of a colloid in the colloid layer when the colloid layer is melted by heat
Data Source
AI summary
A flexible circuit board, a display panel and a display module are provided. The flexible circuit board includes a substrate layer and a colloid layer. The substrate layer has a lamination area and a non-lamination area, the lamination area is used to laminate and connect the flexible circuit board with the display panel, and the lamination area includes a guiding structure. The colloid layer is disposed on a side surface of the substrate layer including the guiding structure, and the guiding structure is used to guide a flow direction of a colloid in the colloid layer when the colloid layer is melted by heat.