Stacking Structure for Circuit Board Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current circuit board manufacturing processes face challenges in ensuring a strong bonding between conducting circuits and dielectric layers, leading to potential separation issues and blister problems due to inadequate contact area and bonding force, especially when forming fine circuits with high roughness surface area ratios (RSAR) that are either too low or too high.
Innovation Solution
A method involving the formation of recess structures on a transferring layer, embedding a dielectric layer with these structures, and pressing the stacking structure onto a base board to create protruding structures that match the recess structures, thereby controlling the roughness surface area ratio (RSAR) between 1.1 and 2.6, enhancing the contact area and bonding force between the conducting circuits and dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the roughness surface area ratio (RSAR) is increased to enhance bonding force, then the contact area and bonding force between conducting circuits and dielectric layers improve, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The transferring layer with pre-formed recess structures is prepared in advance before the dielectric layer is applied. This preliminary action allows the complex surface geometry to be created once during transferring layer formation, rather than requiring complex processing after dielectric layer deposition, thus enhancing bonding force while controlling manufacturing complexity
Solution Approach 2:
The transferring layer acts as an intermediary carrier that temporarily holds the recess structure pattern. It enables the transfer of the complex surface geometry to the dielectric layer through a simplified pressing process, avoiding the need to directly create complex structures on the dielectric layer itself
2Length of moving object
If the line width of conducting circuits is reduced for miniaturization, then the circuit density improves, but the bonding force and contact area decrease leading to separation and blister problems
Solution Approach 1:
The recess structures create localized variations in surface geometry at the interface between the transferring layer and dielectric layer. These local structural modifications increase the contact area and bonding force specifically at the circuit-dielectric interface, allowing fine line widths to maintain adequate bonding strength without requiring overall increase in line width
3Strength
If the recess structures are formed with high precision to control RSAR, then the bonding force improves, but the manufacturing precision requirements and process difficulty increase
Solution Approach 1:
The recess structures are created by copying a pattern from a master mold or template during the transferring layer formation process. This copying approach allows precise control of the RSAR through the master pattern design, while the actual production process inherits this precision without requiring equally complex precision control at each production step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the contact area and bonding force between the conducting circuits and dielectric layers, preventing separation and blister issues, while allowing for the miniaturization of circuit lines to less than 30 μm, thus improving the reliability and performance of the circuit board.
Implementation Method 1
bonding the stacking structure to a base board by pressing, such that the dielectric layer is in contact with the base board
Implementation Method 2
the method further includes curing the thin film by performing a curing process after forming the pattern on the thin film
Implementation Method 3
the exposure processing forms an exposure region and a non-exposure region on the dielectric layer
Data Source
AI summary
A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.