UV-Curable Interlayer Composition for Printed Electronics

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Solution Overview

Problem

Existing metal nanoparticle inks face issues with poor wetting, conductivity loss, and adhesion on substrates during the printing of electronic circuit elements, particularly due to the requirements of thermally curable interlayer compositions which necessitate high temperatures and long curing times.

Innovation Solution

The development of UV-curable interlayer compositions containing a polyallyl isocyanurate compound, an ester of β-mercaptopropionic acid, and a (meth)acrylate monomer, which allow for rapid curing at room temperature and ambient conditions, enhancing ink wetting and adhesion on various substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thermally curable interlayer compositions are used to improve ink adhesion and wetting, then adhesion is improved, but curing temperature and curing time increase significantly

Engineering Contradiction:

ImproveadhesionVSAvoidcuring temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent changes the curing mechanism from thermal to photopolymerization, fundamentally altering the activation parameter from temperature to light exposure. This allows the interlayer composition to cure at room temperature while maintaining strong adhesion properties, directly resolving the contradiction between adhesion improvement and temperature increase.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal curing mechanism with a photopolymerization system using UV or visible light. This substitution eliminates the need for high-temperature equipment and thermal processing infrastructure, enabling curing at ambient conditions while achieving comparable or superior adhesion through photo-initiated crosslinking reactions.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If thermally curable interlayer compositions are used to improve ink adhesion and wetting, then adhesion is improved, but curing time increases significantly

Engineering Contradiction:

ImproveadhesionVSAvoidcuring time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent changes the activation parameter from thermal energy to photonic energy, enabling rapid curing through light exposure. Photopolymerization reactions proceed much faster than thermal curing processes, reducing curing time from hours to seconds or minutes while maintaining strong adhesion through effective crosslinking.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The replacement of thermal curing with photopolymerization fundamentally accelerates the curing process. Light-initiated reactions occur almost immediately upon exposure, eliminating the prolonged thermal diffusion and reaction times required by conventional thermal curing methods, thus dramatically reducing production cycle time.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If high curing temperatures are used to cure interlayer compositions, then curing is achieved, but fine feature printing quality deteriorates

Engineering Contradiction:

Improvecuring completionVSAvoidfine feature printing quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the curing activation from thermal to photonic, enabling curing at room temperature. This prevents thermal degradation of the printed fine features while achieving complete crosslinking and adhesion through light exposure, thereby maintaining high manufacturing precision and feature quality.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient production of interlayer films that facilitate the printing of fine features with excellent adhesion and conductivity, compatible with ink jet printing techniques, and maintains performance on flexible and rigid substrates.

Implementation Method 1

exposing the deposited interlayer composition to UV light under conditions sufficient to cure the interlayer composition

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS10113082B2UV curable interlayer composition for printed electronics application

Publication Date: 2018.10.30 GENESEE VALLEY INNOVATIONS LLC

AI summary

UV-curable interlayer compositions are provided. An interlayer composition may contain a polyallyl isocyanurate compound, an ester of β-mercaptopropionic acid, a monofunctional (meth)acrylate monomer having one or more cyclic groups, and a photoinitiator. Processes of using the interlayer compositions to form multilayer structures and the multilayer structures are also provided.