Projected Electrode Structure for 3D Semiconductor Mounting Stability
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Solution Overview
Problem
Conventional semiconductor devices with three-dimensional mounting structures face issues with warpage and reliability due to resin molding processes, leading to instability in stacked configurations and potential separation of electrodes from the substrate.
Innovation Solution
A semiconductor device with a substrate, embedded semiconductor element, and a projected electrode having a protruding portion with a flat distal end and a larger cross-sectional area within the molding resin, which enhances stability and prevents separation during three-dimensional mounting, along with a manufacturing method involving a release sheet to reduce resin penetration and simplify the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the projected electrode is formed in the region outside of the resin-molded region of the substrate, then the electrode can be exposed for electrical connection, but warpage occurs on the substrate
Solution Approach 1:
The patent applies local quality by forming the projected electrode specifically in the region outside the resin-molded region, creating a localized conductive structure that provides electrical connection while maintaining substrate stability through strategic positioning
2Stability of the object's composition
If the entire front face of the substrate is molded with resin, then substrate warpage is prevented, but the projected electrode cannot be easily exposed
Solution Approach 1:
The patent applies preliminary action by forming the projected electrode before resin molding, positioning it in the region outside the resin-molded region, so that the electrode is already prepared and exposed for connection while the resin molding prevents substrate warpage
3Ease of manufacture
If compression molding is performed to form the molding resin portion, then the semiconductor element is embedded, but the projected electrode may separate from the substrate
Solution Approach 1:
The patent applies beforehand cushioning by forming the projected electrode with a structure that has a cross-sectional area larger than the protruding portion, creating a broader base area within the molding resin that provides enhanced mechanical support and prevents separation during compression molding
4Reliability
If the projected electrode has a larger cross-sectional area within the molding resin, then separation is prevented, but the electrode structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the projected electrode structure into two distinct portions: a protruding portion with a smaller cross-sectional area for electrical connection and a larger cross-sectional area within the molding resin for mechanical stability, allowing each portion to serve its specific function
Data Source
AI summary
A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode 9 is formed in a region outside of an element mounting region of a substrate 5. The projected electrode 9 includes a protruding portion that protrudes from the front face of a molding resin portion 10. The distal end of the protruding portion is a flat face 13. In addition, a portion of the projected electrode 9 whose cross section is larger than the protruding portion is positioned inside the molding resin portion 10.