Carrier Substrate Removal Transmittance Defect Control
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Solution Overview
Problem
The existing methods for separating flexible substrates from carrier substrates in display apparatus manufacturing often result in defects due to over-irradiation with laser beams, leading to unnecessary processing expenses and time, as the presence of defects is not rapidly determined before proceeding with post-processing steps.
Innovation Solution
A carrier substrate removing apparatus that includes a transmittance measuring unit, such as an under vision camera or color determination digital sensor, to rapidly determine defects by measuring the transmittance of the separated carrier substrate, and a controller to adjust the laser energy density based on the measured transmittance, thereby reducing defects and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser irradiation is used to separate the flexible substrate from the carrier substrate, then the separation process is efficient and automated, but defects may occur on the flexible substrate due to over-irradiation
Solution Approach 1:
The patent implements transmittance measurement of the carrier substrate before the laser separation process to predict potential defects. By measuring the transmittance in advance and comparing it with reference values, the system determines whether the flexible substrate will be damaged during separation, allowing preliminary identification of problematic substrates before they undergo laser irradiation.
Solution Approach 2:
The system establishes a feedback loop where transmittance measurement results are used to control the laser separation process. When the measured transmittance falls outside the reference range, the system generates an alarm or prevents laser irradiation, creating a closed-loop control mechanism that adjusts the separation process based on real-time substrate conditions.
2Productivity
If the flexible substrate proceeds to post-processing regardless of potential defects, then the manufacturing process continues without interruption, but processing expenses and time are wasted on defective substrates
Solution Approach 1:
The transmittance measurement is performed in advance before the flexible substrate enters post-processing steps. This preliminary detection allows the system to identify defective substrates early in the manufacturing flow, enabling early intervention before significant processing resources are consumed on substrates that will ultimately fail quality inspection.
Solution Approach 2:
The patent introduces an intermediary detection step (transmittance measurement) between the laser separation process and post-processing. This intermediary mechanism acts as a gatekeeper, filtering out potentially defective substrates before they commit to expensive post-processing operations, thus preventing waste of time and resources.
3Loss of time
If transmittance measurement is implemented to detect defects before post-processing, then processing expenses and time are reduced, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical inspection systems with an optical transmittance measurement system. Instead of using sophisticated mechanical or visual inspection equipment to detect defects, the system uses a relatively simple light transmission measurement approach, substituting mechanical complexity with optical measurement simplicity.
Solution Approach 2:
The invention focuses on measuring a single critical parameter (transmittance) rather than attempting to detect multiple defect types simultaneously. By changing the detection approach to monitor only the transmittance parameter, which correlates with potential laser-induced defects, the system achieves effective defect prediction with minimal additional device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid detection of defects in flexible substrates, reducing unnecessary processing expenses and time by ensuring only defect-free substrates undergo post-processing, thereby improving the reliability and efficiency of the display apparatus manufacturing process.
Implementation Method 1
a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate
Implementation Method 2
a laser irradiation apparatus configured to irradiate the carrier substrate using a laser beam to separate the carrier substrate and the flexible substrate that are bonded to each other
Data Source
AI summary
A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.