Lamination Ancillary Operations TRIZ Cases

A knurled adhesive bolt shank creates a non-positive mechanical connection with the workpiece cutout to provide immediate holding strength.

A stationary dispensing head and fixed creel route composite tow along a constant path to the lay-up tool.

Composite glass fiber layers prevent burn-through and toxic fume emission during fire exposure.

A coupling cam dynamically separates processing and biasing members, eliminating transport interference while maintaining consistent pressing force.

A laminating system with a breaker bar station flattens rolled substrate and film materials before precise automated cutting.

Releaseable adhesive bonds join annular lamination stacks, preventing plastic deformation and burr-induced short circuits during assembly.

Thermoplastic polyurethane films overcome low solid content challenges by using segmented layering and a primer to reach 14-18 MPa interfacial bonding.

Elastic deformation flattens curved glass sheets to enable uniform functional layer deposition, preventing damage during subsequent re-curving.

Applying adhesive before forming controls thickness and prevents squeeze-out, resolving trade-offs between pressing force and connection strength.

Chemically etched anchoring structures on aluminum surfaces fill with matrix material to resolve delamination risks in weight-sensitive aircraft components.

Fusing lower-melting inner cover layers to core outer layers prevents honeycomb deformation during bonding.

A laminate with soft layers encloses electronic devices to provide moisture resistance.

Pre-applied dry adhesive eliminates wet installation mess and moisture-induced buckling in high-humidity environments.

A layered composite applies a cured pigmented paint layer to a substrate using an adhesion-promoting film.

Heating flexible substrate edges creates a melted zone that adheres to rigid carriers, preventing component damage from strong peeling forces.

Applying distinct power levels to substrates and adhesives resolves the trade-off between adhesion strength and polymer integrity, preventing debonding.

Replacing toxic phthalates with DPHP and DINA in a foamed PVC structure eliminates harmful factors while maintaining cold resistance.

A carrier substrate removal apparatus measures optical transmittance to detect defects in flexible substrates.

An encapsulation tool uses a controlled chamber to manage pressure and gas environment, improving seal integrity and curing quality for organic electronics.

A textured release sheet applies a matte coating that diffuses light to mask fingerprints while maintaining scratch resistance.

Chemical etching removes laser-induced modified layers from wafers, preventing fine particle contamination and preserving die strength.

Dual organic peroxides cure acrylic resin at low temperatures, resolving insufficient bonding strength under reduced thermal stress.

A wiring board integrates conductive material into recessed substrate portions to form inner wiring paths.

Pre-positioning frit on the lower tube section prevents residual material from interfering with laser sealing, maintaining vacuum integrity.