Flexible Substrate Edge Melting for Device Separation
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Solution Overview
Problem
The challenge in fabricating flexible electronic devices is the poor fabrication yield due to uneven rigidity and air bubbles when using flexible substrates, which requires varying peeling forces, potentially damaging the components during the separation process from rigid substrates.
Innovation Solution
A method involving heating the edge of the flexible substrate to create a melted edge for adherence, allowing for separation without strong peeling forces, and using planarizing processes like pressurization and environmental depressurization to ensure flatness and reduce air bubbles, eliminating the need for external adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a de-bonding layer or spray coating method is used to adhere the flexible substrate to the rigid substrate, then the flexible substrate can be adhered to the rigid substrate, but air bubbles may remain and uniformity of the flexible substrate covering the rigid substrate is reduced
Solution Approach 1:
The invention removes the de-bonding layer and spray coating method entirely, replacing them with direct adhesion of the flexible substrate to the rigid substrate through Van der Waals forces. This extraction of the intermediate layer eliminates the source of air bubbles and non-uniformity, directly resolving the contradiction between adhesion stability and substrate covering uniformity.
Solution Approach 2:
The invention introduces a melted edge as an intermediary mechanism during the separation process. By heating the edge of the flexible substrate to create a melted state, the separation can occur smoothly without requiring strong peeling forces, thus preventing damage to electronic elements while maintaining good adhesion during fabrication.
2Ease of manufacture
If mechanical peeling technique is applied to separate the flexible substrate from the carrier plate, then the flexible substrate can be removed, but damages to the electronic element may occur in area regions where greater peeling force is exerted
Solution Approach 1:
The invention changes the physical state of the flexible substrate edge by heating it to create a melted edge. This parameter change (from solid to melted state) allows the substrate to be separated from the rigid substrate without requiring strong mechanical peeling forces, thus preventing damage to electronic elements while maintaining ease of manufacture.
Solution Approach 2:
The invention performs preliminary heating of the flexible substrate edge before separation to create a melted edge. This preliminary action softens the material, enabling subsequent separation to occur with minimal force, thereby protecting electronic elements from damage while facilitating easy substrate removal.
3Device complexity
If the flexible substrate is adhered to the rigid substrate directly, then the fabrication process is simplified, but the flexibility of the flexible substrate prevents electronic element from being fabricated directly on it
Solution Approach 1:
The invention segments the fabrication process into two distinct stages: first, fabricating electronic elements on a rigid substrate where the flexible substrate is adhered; second, separating the flexible substrate with its fabricated elements from the rigid substrate. This segmentation allows leveraging the fabrication advantages of rigid substrates while achieving the final flexible device configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the risk of component damage and enhances fabrication yield by allowing for uniform separation of the flexible substrate from the rigid substrate without applying strong peeling forces, while also eliminating the need for external adhesives, thus improving the overall manufacturing process.
Implementation Method 1
A portion of an edge of the flexible substrate is heated, and the heated portion of the edge of the flexible substrate constitutes a melted edge
Implementation Method 2
The area region surrounded by the melted edge of the flexible substrate is in direct contact with the rigid substrate through a Van der Vaals force or an electrostatic force
Implementation Method 3
The area region surrounded by the melted edge of the flexible substrate is in direct contact with the rigid substrate through a Van der Vaals force or an electrostatic force
Data Source
AI summary
A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.